Datasheet BM1Z102FJ, BM1Z103FJ (Rohm) - 9

BM1Z102FJ BM1Z103FJ Absolute Maximum Ratings (Ta = 25 °C)
Parameter Symbol Rating Unit VCC Input Power Supply Voltage VCC -0.3 to +29 V VH_AC1 Pin Voltage VVH_AC1 -0.3 to +600 V VH_AC2 Pin Voltage VVH_AC2 -0.3 to +600 V VH_DC Pin Voltage VVH_DC -0.3 to +600 V ACOUT Pin Voltage VACOUT -0.3 to +29 V DSET Pin Voltage VDSET -0.3 to +7 V DCOUT Pin Voltage VDCOUT -0.3 to +7 V Allowable Dissipation(Note 1) Pd 0.79 W Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax 150 °C
Caution 1:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
Caution 2:
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) SOP-J11: At mounted on a glass epoxy single layer PCB (114.3 mm x 76.2 mm x 1.6 mm). Derate by 6.32 mW/°C if the IC is used in the ambient temperature 25 °C or above.
Thermal Loss
Make the thermal design so that the IC operates in the following conditions. (Because the following temperature is guarantee value, it is necessary to consider margin.) 1. The ambient temperature must be 105 °C or less. 2. The IC’s loss must be the al owable dissipation Pd or less. The thermal abatement characteristics are as follows. (At mounting on a glass epoxy single layer PCB which size is 114.3 mm x 76.2 mm x 1.6 mm.) 1.20 1.00 0.80 ] W[ 0.60 Pd 0.40 0.20 0.00 0 25 50 75 100 125 150 Ta [°C] Figure 13. SOP-J11 Thermal Abatement Characteristic www.rohm.com
TSZ02201-0F1F0A200610-1-2
© 2019 ROHM Co., Ltd. All rights reserved. 9/20 TSZ22111 • 15 • 001
12.Mar.2020 Rev.00 1
Document Outline General Description Features Applications Key Specifications Package Lineup Typical Application Circuit Pin Configuration Pin Descriptions Block Diagram Description of Blocks 1. AC Voltage Zero Cross Detection 1.1 Startup Sequence 1.2 VH_AC1 Pin UVLO 1.3 VH_AC1 and VH_AC2 Pins Noise Filter 1.4 DSET Pin Setting 2. DC Voltage Monitor Circuit Absolute Maximum Ratings Thermal Loss Recommended Operating Conditions Electrical Characteristics Typical Performance Curves I/O Equivalence Circuit Operational Notes 1. Reverse Connection of Power Supply 2. Power Supply Lines 3. Ground Voltage 4. Ground Wiring Pattern 5. Recommended Operating Conditions 6. Inrush Current 7. Testing on Application Boards 8. Inter-pin Short and Mounting Errors 9. Unused Input Pins 10. Regarding the Input Pin of the IC 11. Ceramic Capacitor 12. Thermal Shutdown Circuit (TSD) 13. Over Current Protection Circuit (OCP) Ordering Information Marking Diagram Physical Dimension and Packing Information Revision History