Datasheet MM3Z2V4T1 (ON Semiconductor) - 6

MM3Z2V4T1 SERIES PACKAGE DIMENSIONS SOD−323
CASE 477−02 ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
K
2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F
A
DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
D
1 2
B
5. DIMENSION L IS MEASURED FROM END OF RADIUS.
MILLIMETERS INCHES DIM MIN MAX MIN MAX A
1.60 1.80 0.063 0.071
B
1.15 1.35 0.045 0.053
E C
0.80 1.00 0.031 0.039
D
0.25 0.40 0.010 0.016
E
0.15 REF 0.006 REF
H
0.00 0.10 0.000 0.004
C J
0.089 0.177 0.0035 0.0070
K
2.30 2.70 0.091 0.106
L
0.075 −−− 0.003 −−−
L J H NOTE 5
STYLE 1:
NOTE 3
PIN 1. CATHODE 2. ANODE
SOLDERING FOOTPRINT*
0.63 0.025 0.83 0.033 1.60 0.063 2.85 0.112 SCALE 10:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
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