Datasheet ADP3623, ADP3624, ADP3625, ADP3633, ADP3634, ADP3635 (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | High Speed, Dual, 4 A MOSFET Driver with Thermal Protection |
| Páginas / Página | 16 / 6 — ADP3623/ADP3624/ADP3625/ADP3633/ADP3634/ADP3635. ABSOLUTE MAXIMUM RATINGS … |
| Formato / tamaño de archivo | PDF / 317 Kb |
| Idioma del documento | Inglés |
ADP3623/ADP3624/ADP3625/ADP3633/ADP3634/ADP3635. ABSOLUTE MAXIMUM RATINGS Table 2. Parameter. Rating. ESD CAUTION
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ADP3623/ADP3624/ADP3625/ADP3633/ADP3634/ADP3635 ABSOLUTE MAXIMUM RATINGS Table 2.
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any VDD −0.3 V to +20 V other conditions above those indicated in the operational OUTA, OUTB section of this specification is not implied. Exposure to absolute DC −0.3 V to V + 0.3 V DD maximum rating conditions for extended periods may affect <200 ns −2 V to V + 0.3 V DD device reliability. INA, INA, INB, INB, and SD −0.3 V to V + 0.3 V DD ESD Human Body Model (HBM) 3.5 kV
ESD CAUTION
Field Induced Charged Device Model (FICDM) SOIC_N_EP 1.5 kV MINI_SO_EP 1.0 kV θ , JEDEC 4-Layer Board JA SOIC_N_EP1 59°C/W MINI_SO_EP1 43°C/W Junction Temperature Range −40°C to +150°C Storage Temperature Range −65°C to +150°C Lead Temperature Soldering (10 sec) 300°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 260°C 1 θJA is measured per JEDEC standards, JESD51-2, JESD51-5, and JESD51-7, as appropriate with the exposed pad soldered to the PCB. Rev. A | Page 6 of 16 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Timing Diagrams Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Test Circuit Theory of Operation Input Drive Requirements (INA, AA, INB, AA, and SD) Low-Side Drivers (OUTA, OUTB) Shutdown (SD) Function Overtemperature Protections Supply Capacitor Selection PCB Layout Considerations Parallel Operation Thermal Considerations Design Example Outline Dimensions Ordering Guide
ADP3623/ADP3624/ADP3625/ADP3633/ADP3634/ADP3635 ABSOLUTE MAXIMUM RATINGS Table 2.
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any VDD −0.3 V to +20 V other conditions above those indicated in the operational OUTA, OUTB section of this specification is not implied. Exposure to absolute DC −0.3 V to V + 0.3 V DD maximum rating conditions for extended periods may affect <200 ns −2 V to V + 0.3 V DD device reliability. INA, INA, INB, INB, and SD −0.3 V to V + 0.3 V DD ESD Human Body Model (HBM) 3.5 kV
ESD CAUTION
Field Induced Charged Device Model (FICDM) SOIC_N_EP 1.5 kV MINI_SO_EP 1.0 kV θ , JEDEC 4-Layer Board JA SOIC_N_EP1 59°C/W MINI_SO_EP1 43°C/W Junction Temperature Range −40°C to +150°C Storage Temperature Range −65°C to +150°C Lead Temperature Soldering (10 sec) 300°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 260°C 1 θJA is measured per JEDEC standards, JESD51-2, JESD51-5, and JESD51-7, as appropriate with the exposed pad soldered to the PCB. Rev. A | Page 6 of 16 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Timing Diagrams Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Test Circuit Theory of Operation Input Drive Requirements (INA, AA, INB, AA, and SD) Low-Side Drivers (OUTA, OUTB) Shutdown (SD) Function Overtemperature Protections Supply Capacitor Selection PCB Layout Considerations Parallel Operation Thermal Considerations Design Example Outline Dimensions Ordering Guide