Datasheet BAS116 (Nexperia) - 3

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Nexperia BAS116 Low-leakage diode 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from In free air [1] - - 500 K/W junction to ambient Rth(j-sp) thermal resistance from [2] - - 330 K/W junction to solder point [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Soldering point of cathode tab.
10. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit
VF forward voltage IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; - - 0.9 V Tj = 25 °C IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02; - - 1 V Tj = 25 °C IF = 50 mA; tp ≤ 300 µs; δ ≤ 0.02; - - 1.1 V Tj = 25 °C IF = 150 mA; tp ≤ 300 µs; δ ≤ 0.02; - - 1.25 V Tj = 25 °C IR reverse current VR = 75 V; pulsed; Tj = 25 °C - 0.003 5 nA VR = 75 V; pulsed; Tj = 150 °C - 3 80 nA Cd diode capacitance VR = 0 V; f = 1 MHz; Tj = 25 °C - 2 - pF trr reverse recovery time IF = 10 mA; IR = 10 mA; RL = 100 Ω; - 0.8 3 µs IR(meas) = 1 mA; Tj = 25 °C mlb755 mlb752 300 300 IF IF (mA) (mA) 200 200 (1) (2) (3) 100 100 0 0 0 100 200 0 0.4 0.8 1.2 1.6 Tamb (°C) VF (V)
Fig. 1. Forward current as a function of ambient
(1) Tamb = 150 °C; typical values
temperature; derating curve
(2) Tamb = 25 °C; typical values (3) Tamb = 25 °C; maximum values
Fig. 2. Forward current as a function of forward voltage; per diode
BAS116 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. Al rights reserved
Product data sheet 5 August 2020 3 / 10
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents