Datasheet MBRS130T3G, NRVBS130T3G, NRVBS130N (ON Semiconductor)
| Fabricante | ON Semiconductor |
| Descripción | Surface Mount Schottky Power Rectifier |
| Páginas / Página | 5 / 1 — www.onsemi.com. SCHOTTKY BARRIER. RECTIFIER. 1.0 AMPERE. 30 VOLTS. … |
| Revisión | 10 |
| Formato / tamaño de archivo | PDF / 218 Kb |
| Idioma del documento | Inglés |
www.onsemi.com. SCHOTTKY BARRIER. RECTIFIER. 1.0 AMPERE. 30 VOLTS. Features. SMB. CASE 403A. MARKING DIAGRAM. Mechanical Characteristics
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Surface Mount Schottky Power Rectifier MBRS130T3G, NRVBS130T3G, NRVBS130N
www.onsemi.com
This device employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay
SCHOTTKY BARRIER
contact. Ideally suited for low voltage, high frequency rectification, or
RECTIFIER
as free wheeling and polarity protection diodes in surface mount
1.0 AMPERE
applications where compact size and weight are critical to the system.
30 VOLTS Features
• Small Compact Surface Mountable Package with J−Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction • Very Low Forward Voltage Drop (0.6 Volts Max @ 1.0 A, T
SMB
J = 25°C)
CASE 403A
• Excellent Ability to Withstand Reverse Avalanche Energy Transients • Guardring for Stress Protection
MARKING DIAGRAM
• NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* AYWW • These are Pb−Free Devices B13G G
Mechanical Characteristics
• Case: Epoxy, Molded A = Assembly Location** • Weight: 95 mg (approximately) Y = Year WW = Work Week • Finish: All External Surfaces Corrosion Resistant and Terminal G = Pb−Free Package Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: (Note: Microdot may be in either location) 260°C Max. for 10 Seconds **The Assembly Location code (A) is front side • Shipped in 12 mm Tape and Reel, 2500 units per reel optional. In cases where the Assembly Location is stamped in the package bottom (molding ejecter pin), • Cathode Polarity Band the front side assembly code may be blank.
ORDERING INFORMATION Device Package Shipping
† MBRS130T3G SMB 2500 / (Pb−Free) Tape & Reel NRVBS130T3G* SMB 2500 / (Pb−Free) Tape & Reel NRVBS130NT3G* SMB 2500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
December, 2019 − Rev. 10 MBRS130T3/D
www.onsemi.com
This device employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay
SCHOTTKY BARRIER
contact. Ideally suited for low voltage, high frequency rectification, or
RECTIFIER
as free wheeling and polarity protection diodes in surface mount
1.0 AMPERE
applications where compact size and weight are critical to the system.
30 VOLTS Features
• Small Compact Surface Mountable Package with J−Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction • Very Low Forward Voltage Drop (0.6 Volts Max @ 1.0 A, T
SMB
J = 25°C)
CASE 403A
• Excellent Ability to Withstand Reverse Avalanche Energy Transients • Guardring for Stress Protection
MARKING DIAGRAM
• NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* AYWW • These are Pb−Free Devices B13G G
Mechanical Characteristics
• Case: Epoxy, Molded A = Assembly Location** • Weight: 95 mg (approximately) Y = Year WW = Work Week • Finish: All External Surfaces Corrosion Resistant and Terminal G = Pb−Free Package Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: (Note: Microdot may be in either location) 260°C Max. for 10 Seconds **The Assembly Location code (A) is front side • Shipped in 12 mm Tape and Reel, 2500 units per reel optional. In cases where the Assembly Location is stamped in the package bottom (molding ejecter pin), • Cathode Polarity Band the front side assembly code may be blank.
ORDERING INFORMATION Device Package Shipping
† MBRS130T3G SMB 2500 / (Pb−Free) Tape & Reel NRVBS130T3G* SMB 2500 / (Pb−Free) Tape & Reel NRVBS130NT3G* SMB 2500 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
December, 2019 − Rev. 10 MBRS130T3/D