link to page 2 link to page 2 link to page 2 link to page 2 link to page 2 link to page 2 NCV5230MAXIMUM RATINGSRatingSymbolValueUnit Single Supply Voltage VCC 18 V Dual Supply Voltage VS ±9 V Input Voltage (Note 1) VIN ±9 (18) V Differential Input Voltage (Note 1) ±VS V Common−Mode Voltage (Positive) VCM VCC + 0.5 V Common−Mode Voltage (Negative) VCM VEE − 0.5 V Power Dissipation (Note 2) PD 500 mW Thermal Resistance, Junction−to−Ambient D Package RqJA 182 °C/W Operating Junction Temperature (Note 2) TJ 150 °C Operating Temperature Range TA −40 to 125 °C 80 Output Short−Circuit Duration to Either Power Supply Pin (Notes 2 and 3) Indefinite s Storage Temperature Tstg −65 to 150 °C Lead Soldering Temperature (10 sec max) Tsld 230 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Can exceed the supply voltages when VS ≤ ±7.5 V (15 V). 2. The maximum operating junction temperature is 150°C. At elevated temperatures, devices must be derated according to the package thermal resistance and device mounting conditions. Derate above 25°C at the following rates: D package at 5.5 mW/°C. 3. Momentary shorts to either supply are permitted in accordance to transient thermal impedance limitations determined by the package and device mounting conditions. RECOMMENDED OPERATING CONDITIONSCharacteristicValueUnit Single Supply Voltage 1.8 to 15 V Dual Supply Voltage ±0.9 to ±7.5 V Common−Mode Voltage (Positive) VCC + 0.25 V Common−Mode Voltage (Negative) VEE − 0.25 V Temperature −40 to +125 °C www.onsemi.com2