Datasheet ADG772 (Analog Devices) - 5

Data Sheet ADG772 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS A D A 1 N 2 S G S 2 1 0 1 1 1 D1 1 9 D2 ADG772 D S1B 2 8 S2BB A TOP VIEW 1 N A 2 (Not to Scale) S G S 0 NC 3 7 NC 1 1 9 4 5 6 D1 1 2 2 8 D2 D N N ADG772 I I D V S1B 3 TOP VIEW 7 S2B NOTES (Not to Scale) 1. NC = NO CONNECT. 2. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR INCREASED RELIABILITY OF THE SOLDER 4
02
5 6
3 -0
JOINTS AND MAXIMUM THERMAL CAPABILITY, IT 1 2
-00
D
92
IS RECOMMENDED THAT THE PAD BE SOLDERED N N I I D
66 692
V
00
TO A GROUND REFERENCE.
06 Figure 2. 10-Lead Mini LFCSP Pin Configuration Figure 3. 12-Lead LFCSP Pin Configuration
Table 3. Pin Function Descriptions Pin No. 10-Lead Mini LFCSP 12-Lead LFCSP Mnemonic Description
1 12 S1A Source Terminal. Can be an input or an output. 2 1 D1 Drain Terminal. Can be an input or an output. 3 2 S1B Source Terminal. Can be an input or an output. 4 4 IN1 Logic Control Input. This pin controls Switch S1A and Switch S1B to D1. 5 5 IN2 Login Control Input. This pin controls Switch S2A and Switch S2B to D2. 6 6 VDD Most Positive Power Supply Potential. 7 8 S2B Source Terminal. Can be an input or an output. 8 9 D2 Drain Terminal. Can be an input or an output. 9 10 S2A Source Terminal. Can be an input or an output. 10 11 GND Ground (0 V) Reference. Not applicable 3, 7 NC No Connect. Not applicable 13 EPAD Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to a ground reference.
TRUTH TABLE Table 4. Logic (IN1 or IN2) Switch A (S1A or S2A) Switch B (S1B or S2B)
0 Off On 1 On Off Rev. C | Page 5 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS REVISION HISTORY ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TRUTH TABLE TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY OUTLINE DIMENSIONS ORDERING GUIDE