ADG619/ADG620TERMINOLOGY IDDCD, CS (On) Positive supply current. On switch capacitance. ISStON Negative supply current. Delay between applying the digital control input and the output switching on. RON Ohmic resistance between D and S terminals. tOFF Delay between applying the digital control input and the output ΔRON switching off. On resistance match between any two channels. tMBBRFLAT (ON) On time is measured between the 80% points of both switches, Flatness is defined as the difference between the maximum and when switching from one address state to another. minimum value of on resistance as measured over the specified analog signal range. tBBM Off time or on time is measured between the 90% points of IS (Off) both switches, when switching from one address state Source leakage current with the switch off. to another. ID, IS (On)Charge Injection Channel leakage current with the switch on. A measure of the glitch impulse transferred from the digital V input to the analog output during switching. D, VS Analog voltage on Terminal D and Terminal S. CrosstalkV A measure of unwanted signal coupled through from one INL Maximum input voltage for Logic 0. channel to another as a result of parasitic capacitance. VOff IsolationINH Minimum input voltage for Logic 1. A measure of unwanted signal coupling through an off switch. IBandwidthINL, IINH Input current of the digital input. The frequency response of the on switch. CInsertion LossS (Off ) Off switch source capacitance. The loss due to the on resistance of the switch. Rev. C | Page 10 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DUAL SUPPLY SINGLE SUPPLY ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE