Datasheet ADG5412, ADG5413 (Analog Devices) - 9
| Fabricante | Analog Devices |
| Descripción | High Voltage Latch-Up Proof, Quad SPST Switches |
| Páginas / Página | 19 / 9 — Data Sheet. ADG5412/ADG5413. PIN CONFIGURATIONS AND FUNCTION … |
| Revisión | D |
| Formato / tamaño de archivo | PDF / 469 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADG5412/ADG5413. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. IN1. 16 IN2. D1 2. 15 D2. S1 3. 14 S2. ADG5412/. S1 1. 12 S2. VSS 4
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Data Sheet ADG5412/ADG5413 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 1 1 2 2 IN1 N N 1 16 IN2 D I I D 6 5 4 3 D1 2 15 D2 1 1 1 1 S1 3 14 S2 ADG5412/ S1 1 12 S2 VSS 4 13 V ADG5413 DD VSS 2 11 V ADG5412/ DD GND 5 TOP VIEW 12 NIC (Not to Scale) ADG5413 GND 3 10 NIC S4 6 11 S3 TOP VIEW S4 4 9 S3 D4 7 10 D3 IN4 8 9 IN3 5 6 7 8 4 4 3 3
2
NOTES D NI NI D
00 2-
1. NIC = NOT INTERNALLY CONNECTED. NOTES
20
LEAVE THIS PIN FLOATING.
09
1. NIC = NOT INTERNALLY CONNECTED. LEAVE THIS PIN FLOATING. 2. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR INCREASED
3
RELIABILITY OF THE SOLDER JOINTS AND MAXIMUM THERMAL
00 2-
CAPABILITY, IT IS RECOMMENDED THAT THE PAD BE SOLDERED TO THE SUBSTRATE, V
920
SS.
0 Figure 2. TSSOP Pin Configuration Figure 3. LFCSP Pin Configuration
Table 7. Pin Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 IN1 Logic Control Input 1. 2 16 D1 Drain Terminal 1. This pin can be an input or output. 3 1 S1 Source Terminal 1. This pin can be an input or output. 4 2 VSS Most Negative Power Supply Potential. 5 3 GND Ground (0 V) Reference. 6 4 S4 Source Terminal 4. This pin can be an input or output. 7 5 D4 Drain Terminal 4. This pin can be an input or output. 8 6 IN4 Logic Control Input 4. 9 7 IN3 Logic Control Input 3. 10 8 D3 Drain Terminal 3. This pin can be an input or output. 11 9 S3 Source Terminal 3. This pin can be an input or output. 12 10 NIC Not Internally Connected. Leave this pin floating. 13 11 VDD Most Positive Power Supply Potential. 14 12 S2 Source Terminal 2. This pin can be an input or output. 15 13 D2 Drain Terminal 2. This pin can be an input or output. 16 14 IN2 Logic Control Input 2. EP Exposed Pad The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 8. ADG5412 Truth Table INx Switch Condition
1 On 0 Off
Table 9. ADG5413 Truth Table INx S1, S4 S2, S3
0 Off On 1 On Off Rev. D | Page 9 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS REVISION HISTORY SPECIFICATIONS ±15 V DUAL SUPPLY ±20 V DUAL SUPPLY 12 V SINGLE SUPPLY 36 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, Sx OR Dx ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY TRENCH ISOLATION APPLICATIONS INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE
2
NOTES D NI NI D
00 2-
1. NIC = NOT INTERNALLY CONNECTED. NOTES
20
LEAVE THIS PIN FLOATING.
09
1. NIC = NOT INTERNALLY CONNECTED. LEAVE THIS PIN FLOATING. 2. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR INCREASED
3
RELIABILITY OF THE SOLDER JOINTS AND MAXIMUM THERMAL
00 2-
CAPABILITY, IT IS RECOMMENDED THAT THE PAD BE SOLDERED TO THE SUBSTRATE, V
920
SS.
0 Figure 2. TSSOP Pin Configuration Figure 3. LFCSP Pin Configuration
Table 7. Pin Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 IN1 Logic Control Input 1. 2 16 D1 Drain Terminal 1. This pin can be an input or output. 3 1 S1 Source Terminal 1. This pin can be an input or output. 4 2 VSS Most Negative Power Supply Potential. 5 3 GND Ground (0 V) Reference. 6 4 S4 Source Terminal 4. This pin can be an input or output. 7 5 D4 Drain Terminal 4. This pin can be an input or output. 8 6 IN4 Logic Control Input 4. 9 7 IN3 Logic Control Input 3. 10 8 D3 Drain Terminal 3. This pin can be an input or output. 11 9 S3 Source Terminal 3. This pin can be an input or output. 12 10 NIC Not Internally Connected. Leave this pin floating. 13 11 VDD Most Positive Power Supply Potential. 14 12 S2 Source Terminal 2. This pin can be an input or output. 15 13 D2 Drain Terminal 2. This pin can be an input or output. 16 14 IN2 Logic Control Input 2. EP Exposed Pad The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 8. ADG5412 Truth Table INx Switch Condition
1 On 0 Off
Table 9. ADG5413 Truth Table INx S1, S4 S2, S3
0 Off On 1 On Off Rev. D | Page 9 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS REVISION HISTORY SPECIFICATIONS ±15 V DUAL SUPPLY ±20 V DUAL SUPPLY 12 V SINGLE SUPPLY 36 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, Sx OR Dx ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY TRENCH ISOLATION APPLICATIONS INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE