link to page 9 link to page 8 ADG4612/ADG4613ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Stresses above those listed under Absolute Maximum Ratings Table 6. may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any Parameter Rating other conditions above those listed in the operational sections VDD to VSS 18 V of this specification is not implied. Exposure to absolute VDD to GND −0.3 V to +18 V maximum rating conditions for extended periods may affect VSS to GND +0.3 V to −7 V device reliability. Analog Inputs; VS to VD 18 V Analog Inputs; V Only one absolute maximum rating may be applied at any one D , VS −7 V to +18 V Most Negative (V time. S,VD or VSS) to 18 V Most Positive (VS,VD, Inx, or VDD) THERMAL RESISTANCE Digital Inputs, INx GND − 0.3 V to +18 V Peak Current, Sx or Dx 350 mA (pulsed at 1 ms, θJA is specified for a 4-layer board and, where applicable, with 10% duty cycle max) the exposed pad soldered to the board. Continuous Current, Sx or Dx1 Data + 15% Table 7. Thermal Resistance Operating Temperature Range −40°C to +105°C Package Typeθ Storage Temperature Range −65°C to +150°C JA Unit 16-Lead TSSOP 112 °C/W Junction Temperature 150°C 16-Lead LFCSP 48.7 °C/W Reflow Soldering Peak 260 (0/−5)°C Temperature, Pb-free 1 See Table 4. ESD CAUTION Rev. 0 | Page 9 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS SPECIFICATIONS 5 V DUAL SUPPLY 12 V SINGLE SUPPLY 5 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, SX OR DX POWER SUPPLY OPERATION ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY THEORY OF OPERATION Normal Mode Isolation Mode Positive Fault Condition Negative Fault Condition; Negative Signal Handling APPLICATIONS INFORMATION Power Supply Sequencing OUTLINE DIMENSIONS ORDERING GUIDE