link to page 7 ADG5212/ADG5213Data SheetABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 6. Stresses above those listed under Absolute Maximum Ratings ParameterRating may cause permanent damage to the device. This is a stress V rating only; functional operation of the device at these or any DD to VSS 48 V V other conditions above those indicated in the operational DD to GND −0.3 V to +48 V V section of this specification is not implied. Exposure to absolute SS to GND +0.3 V to −48 V Analog Inputs1 V maximum rating conditions for extended periods may affect SS − 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first device reliability. Digital Inputs1 VSS − 0.3 V to VDD + 0.3 V or Only one absolute maximum rating can be applied at any 30 mA, whichever occurs first one time. Peak Current, Sx or Dx Pin 60 mA (pulsed at 1 ms, 10% duty cycle maximum) ESD CAUTION Continuous Current, Sx or Dx2 Data + 15% Temperature Operating Range −40°C to +125°C Storage Range −65°C to +150°C Junction 150°C Thermal Impedance, θJA 16-Lead TSSOP (4-Layer Board) 112.6°C/W 16-Lead LFCSP (4-Layer Board) 30.4°C/W Reflow Soldering Peak 260(+0/−5)°C Temperature, Pb Free 1 Overvoltages at the INx, Sx, and Dx pins are clamped by internal diodes. Limit current to the maximum ratings given. 2 See Table 5. Rev. A | Page 8 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS REVISION HISTORY SPECIFICATIONS ±15 V DUAL SUPPLY ±20 V DUAL SUPPLY 12 V SINGLE SUPPLY 36 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, Sx OR Dx ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY TRENCH ISOLATION APPLICATIONS INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE