FDDTypical Characteristics6637 35 1 ECV P-EN D = 0.5 IVAT RθJA(t) = r(t) * RθJA CIST 0.2 ES RθJA = 96 °C/W FE 0.1 FR 0.1 CELDA 0.05 EhM P(pk) IZ LER 0.02 aA t1 nnM 0.01 0.01 RT TH t2 O NEN SI TJ - TA = P * RθJA(t) e SINGLE PULSE r(t),Nl PA Duty Cycle, D = t1 / t2 R T 0.001 o 0.001 0.01 0.1 1 10 100 1000 wt1, TIME (sec)e rTrFigure 13. Transient Thermal Response CurveeThermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design.n ch ® MOSFET FDD6637 Rev. C(W) www.fairchildsemi.com