5 Timing Specifications 5.1 Sensor System Timings The timings refer to the power up and reset of the ASIC part and do not reflect the usefulness of the readings. ParameterSymbolConditionMin.Typ.Max.UnitComments Power-up time tPU After hard reset, VDD ≥VPOR - 0.4 0.6 ms - Soft reset time tSR After soft reset - 0.4 0.6 ms - Table 6 System timing specifications. 5.2 Communication TimingsParameterSymbol ConditionsMin.Typ.Max.UnitsComments SCL clock frequency fSCL - 0 - 400 kHz - Hold time (repeated) START tHD;STA After this period, the 0.6 - - µs - condition first clock pulse is generated LOW period of the SCL clock tLOW - 1.3 - - µs - HIGH period of the SCL clock tHIGH - 0.6 - - µs - Set-up time for a repeated START tSU;STA - 0.6 - - µs - condition SDA hold time tHD;DAT - 0 - - ns - SDA set-up time tSU;DAT - 100 - - ns - SCL/SDA rise time tR - - - 300 ns - SCL/SDA fall time tF - - - 300 ns - SDA valid time tVD;DAT - - - 0.9 µs - Set-up time for STOP condition tSU;STO - 0.6 - - µs - Capacitive load on bus line CB - 400 pF - Table 7 Communication timing specifications. 1/fSCL tHIGH tLOW tR tF 70% SCL 30% tSU;DAT tHD;DAT DATA IN 70% SDA 30% tR tVD;DAT tF DATA OUT 70% SDA 30% Figure 10 Timing diagram for digital input/output pads. SDA directions are seen from the sensor. Bold SDA lines are controlled by the sensor; plain SDA lines are controlled by the micro-controller. Note that SDA valid read time is triggered by falling edge of preceding toggle. www.sensirion.com Version 1.0 – May 2020 – D1 7/19 Document Outline 1 Sensor Performance 1.1 Gas Sensing Performance 1.2 Air Quality Signals 1.3 Recommended Operating and Storage Conditions 2 Electrical Specifications 3 Interface Specifications The SGP30 comes in a 6-pin DFN package, see Table 4. 4 Absolute Minimum and Maximum Ratings 5 Timing Specifications 5.1 Sensor System Timings 5.2 Communication Timings 6 Operation and Communication 6.1 Power-Up and Communication Start 6.2 Measurement Communication Sequence 6.3 Measurement Commands 6.4 Soft Reset 6.5 Get Serial ID 6.6 Checksum Calculation 6.7 Communication Data Sequences 7 Quality 7.1 Environmental Stability 7.2 Material Contents 8 Device Package 8.1 Moisture Sensitivity Level 8.2 Traceability 8.3 Package Outline 8.4 Landing Pattern 8.5 Soldering Instructions 9 Tape & Reel Package 10 Ordering Information Revision History Important Notices Warning, Personal Injury ESD Precautions Warranty Headquarters and Subsidiaries