Datasheet NCP502, NCV502 (ON Semiconductor) - 2
| Fabricante | ON Semiconductor |
| Descripción | Voltage Regulator - CMOS Low Iq, Low-Dropout 80 mA |
| Páginas / Página | 10 / 2 — NCP502, NCV502. PIN FUNCTION DESCRIPTION. Pin No. Pin Name. Description. … |
| Revisión | 21 |
| Formato / tamaño de archivo | PDF / 285 Kb |
| Idioma del documento | Inglés |
NCP502, NCV502. PIN FUNCTION DESCRIPTION. Pin No. Pin Name. Description. MAXIMUM RATINGS. Rating. Symbol. Value. Unit
Línea de modelo para esta hoja de datos
- NCP502SN28T1G NCP502SN29T1G NCP502SN30T1G NCP502SN31T1G NCP502SN33T1G NCP502SN34T1G NCP502SN35T1G NCP502SN36T1G NCP502SN37T1G NCP502SN50T1G NCP502SQ15T2G NCP502SQ18T2G NCP502SQ25T2G NCP502SQ27T2G NCP502SQ28T2G NCP502SQ29T2G NCP502SQ30T2G NCP502SQ31T2G NCP502SQ33T2G NCP502SQ34T2G NCP502SQ35T2G NCP502SQ36T2G NCP502SQ37T2G NCP502SQ50T2G NCV502SN33T1G NCV502SN50T1G
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NCP502, NCV502 PIN FUNCTION DESCRIPTION
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ
Pin No.
ÁÁÁÁÁ
Pin Name
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Description
ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 1 ÁÁÁÁÁ Vin Positive power supply input voltage. ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 2 ÁÁÁÁÁ GND Power supply ground. ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 3 ÁÁÁÁÁ Enable This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 4 N/C No internal connection. ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ 5 Vout Regulated output voltage. ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
MAXIMUM RATINGS Rating Symbol Value Unit
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Input Voltage ÁÁÁÁÁ Vin ÁÁÁÁÁÁÁÁ 12 ÁÁÁÁ V ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ Enable Voltage ÁÁÁÁÁ Enable ÁÁÁÁÁÁÁÁ −0.3 to Vin +0.3 V ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ Output Voltage ÁÁÁÁÁ Vout ÁÁÁÁÁÁÁÁ −0.3 to Vin +0.3 V ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ Power Dissipation and Thermal Characteristics ÁÁÁÁÁÁÁÁ Power Dissipation PD Internally Limited W ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ Operating Junction Temperature TJ +150 °C ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ Operating Ambient Temperature NCP502 TA −40 to +85 °C ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ NCV502 −40 to +125 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁ Storage Temperature Tstg −55 to +150 °C ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Latchup capability (85°C) ±100 mA DC with trigger voltage.
THERMAL CHARACTERISTICS Rating Symbol Test Conditions Value Unit
Thermal Characteristics, TSOP−5 (Note 2) RJA 1 oz Copper Thickness, 100 mm2 °C/W Thermal Resistance, Junction−to−Air (Note 3) 205 Thermal Resistance, Junction−to−Ambient, SC70−5 RJA 400 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ W °C/W ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ NOTE: Single component mounted on a 80 x 80 x 15 mm FR4 PCB with stated copper head spreading area. Using the following ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12. 2. True no connect. Printed circuit board traces are allowable. 3. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015. Machine Model Method 200 V..
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NCP502, NCV502 PIN FUNCTION DESCRIPTION
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ
Pin No.
ÁÁÁÁÁ
Pin Name
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Description
ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 1 ÁÁÁÁÁ Vin Positive power supply input voltage. ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 2 ÁÁÁÁÁ GND Power supply ground. ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 3 ÁÁÁÁÁ Enable This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 4 N/C No internal connection. ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ 5 Vout Regulated output voltage. ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
MAXIMUM RATINGS Rating Symbol Value Unit
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Input Voltage ÁÁÁÁÁ Vin ÁÁÁÁÁÁÁÁ 12 ÁÁÁÁ V ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ Enable Voltage ÁÁÁÁÁ Enable ÁÁÁÁÁÁÁÁ −0.3 to Vin +0.3 V ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ Output Voltage ÁÁÁÁÁ Vout ÁÁÁÁÁÁÁÁ −0.3 to Vin +0.3 V ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ Power Dissipation and Thermal Characteristics ÁÁÁÁÁÁÁÁ Power Dissipation PD Internally Limited W ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ Operating Junction Temperature TJ +150 °C ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ Operating Ambient Temperature NCP502 TA −40 to +85 °C ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ NCV502 −40 to +125 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁ Storage Temperature Tstg −55 to +150 °C ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁ Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Latchup capability (85°C) ±100 mA DC with trigger voltage.
THERMAL CHARACTERISTICS Rating Symbol Test Conditions Value Unit
Thermal Characteristics, TSOP−5 (Note 2) RJA 1 oz Copper Thickness, 100 mm2 °C/W Thermal Resistance, Junction−to−Air (Note 3) 205 Thermal Resistance, Junction−to−Ambient, SC70−5 RJA 400 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ W °C/W ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ NOTE: Single component mounted on a 80 x 80 x 15 mm FR4 PCB with stated copper head spreading area. Using the following ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12. 2. True no connect. Printed circuit board traces are allowable. 3. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015. Machine Model Method 200 V..
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