ASMT-Rx45-xxxxx Data Sheet 0.45-mm Leadframe-Based Surface Mount ChipLED Figure 1: Relative Intensity vs. WavelengthFigure 2: Forward Current vs. Forward Voltage1100ORANGEAMBER0.9RED0.8YELLOW0.7GREENAMBER/0.6ORANGEYELLOW GREENRED0.5100.40.3RELATIVE INTENSITY- FORWARD CURRENT - mA0.2IF0.1013804304805305806306807307800.000.501.001.502.002.503.003.50WAVELENGTH-nmV F - FORWARD VOLTAGE - VFigure 3: Luminous Intensity vs. Forward CurrentFigure 4: Maximum Forward Current vs. Ambient Temper- ature. Derated based on TJMAX = 110°C, R JA = 465°C/W.1.40251.20201.00150.800.6010(NORMALIZED AT 20mA) 0.40RELATIVE LUMINOUS INTENSITYMAX. FORWARD CURRENT - mA50.200.000051015202530020406080100120IF - FORWARD CURRENT - mAAMBIENT TEMPERATURE - °CFigure 5: Radiation PatternFigure 6: Recommended Soldering Land Pattern1.00.90.80.8(0.031)0.70.60.50.40.80.70.8(0.031) (0.028) (0.031)RELATIVE INTENSITY 0.30.20.1 1. All dimensions are in millimeters (inches). 0.0-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise ANGLE specified. Broadcom AV02-0378EN 4 Document Outline Description Features Applications Package Dimensions Device Selection Guide Part Numbering System Absolute Maximum Ratings at TA = 25°C Electrical Characteristics at TA = 25°C Optical Characteristics at TA = 25°C Intensity Bin Select (X3X4) Light Intensity (IV) Bin Limits Color Bin Select (X5) Packaging Option (X6) Forward Voltage (VF) Bin Limits Color Bin Limits Yellow Green Color Bin Yellow/Amber Color Bin Orange Color Bin Red Color Bin Red Orange Color Bin Moisture Sensitivity