Datasheet ASMT-Rx45-xxxxx (Broadcom) - 2
| Fabricante | Broadcom |
| Descripción | 0.45mm Leadframe-Based Surface Mount ChipLED |
| Páginas / Página | 9 / 2 — ASMT-Rx45-xxxxx. Package Dimensions. 0.45. Lead. Cathode. 0.8. Frame. … |
| Formato / tamaño de archivo | PDF / 511 Kb |
| Idioma del documento | Inglés |
ASMT-Rx45-xxxxx. Package Dimensions. 0.45. Lead. Cathode. 0.8. Frame. Side. LED Die. 0.6. 1.6. 1.1. 0.4. Resin. NOTE:. Device Selection Guide. Min. Iv
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ASMT-Rx45-xxxxx
Data Sheet 0.45-mm Leadframe-Based Surface Mount ChipLED
Package Dimensions 0.45 Lead Cathode 0.8 Frame Side LED Die 0.6 1.6 1.1 0.4 Resin NOTE:
1. All dimensions are in millimeters. 2. Tolerance is ± 0.1 mm unless otherwise specified.
Device Selection Guide Min. Iv Typ. Iv Test Current Dice Part Number (mcd) (mcd) (mA) Colors Technology Package Description
ASMT-RR45-AQ902 90.0 120.0 20 Red AlInGaP Untinted, Diffused ASMT-RJ45-AQ502 71.5 130.0 20 Orange AlInGaP Untinted, Diffused ASMT-RF45-AN002 28.0 60.0 20 Yellow Green AlInGaP Untinted, Diffused ASMT-RA45-AP932 57.0 90.0 20 Amber AlInGaP Untinted, Diffused ASMT-RH45-AQ502 71.5 110.0 20 Red Orange AlInGaP Untinted, Diffused
NOTE:
1. The luminous intensity, lv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the LED package. 2. Tolerance: ±15%.
Part Numbering System A S M T - R X1 45 - X2 X3 X4 X5 X6 Packaging Option Color Bin Selection Max. Intensity Bin Min. Intensity Bin LED Chip Color
Broadcom AV02-0378EN 2 Document Outline Description Features Applications Package Dimensions Device Selection Guide Part Numbering System Absolute Maximum Ratings at TA = 25°C Electrical Characteristics at TA = 25°C Optical Characteristics at TA = 25°C Intensity Bin Select (X3X4) Light Intensity (IV) Bin Limits Color Bin Select (X5) Packaging Option (X6) Forward Voltage (VF) Bin Limits Color Bin Limits Yellow Green Color Bin Yellow/Amber Color Bin Orange Color Bin Red Color Bin Red Orange Color Bin Moisture Sensitivity
Data Sheet 0.45-mm Leadframe-Based Surface Mount ChipLED
Package Dimensions 0.45 Lead Cathode 0.8 Frame Side LED Die 0.6 1.6 1.1 0.4 Resin NOTE:
1. All dimensions are in millimeters. 2. Tolerance is ± 0.1 mm unless otherwise specified.
Device Selection Guide Min. Iv Typ. Iv Test Current Dice Part Number (mcd) (mcd) (mA) Colors Technology Package Description
ASMT-RR45-AQ902 90.0 120.0 20 Red AlInGaP Untinted, Diffused ASMT-RJ45-AQ502 71.5 130.0 20 Orange AlInGaP Untinted, Diffused ASMT-RF45-AN002 28.0 60.0 20 Yellow Green AlInGaP Untinted, Diffused ASMT-RA45-AP932 57.0 90.0 20 Amber AlInGaP Untinted, Diffused ASMT-RH45-AQ502 71.5 110.0 20 Red Orange AlInGaP Untinted, Diffused
NOTE:
1. The luminous intensity, lv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the LED package. 2. Tolerance: ±15%.
Part Numbering System A S M T - R X1 45 - X2 X3 X4 X5 X6 Packaging Option Color Bin Selection Max. Intensity Bin Min. Intensity Bin LED Chip Color
Broadcom AV02-0378EN 2 Document Outline Description Features Applications Package Dimensions Device Selection Guide Part Numbering System Absolute Maximum Ratings at TA = 25°C Electrical Characteristics at TA = 25°C Optical Characteristics at TA = 25°C Intensity Bin Select (X3X4) Light Intensity (IV) Bin Limits Color Bin Select (X5) Packaging Option (X6) Forward Voltage (VF) Bin Limits Color Bin Limits Yellow Green Color Bin Yellow/Amber Color Bin Orange Color Bin Red Color Bin Red Orange Color Bin Moisture Sensitivity