Datasheet CYW43455 (Cypress) - 10

link to page 121
CYW43455 Figure 4. Typical Power Topology (Page 2 of 2)
CYW43455 Shaded areas are internal to the device. BTLDO2P5 2.5V Max 70 mA BT CLASS 1 PA Avg 15 mA 2.2 µF 10 pF 0402 0201 WL RF – PA (2.4 GHz, 5 GHz) LDO3P3 VBAT Spike 800 mA WL RF – PAD (2.4 GHz, 5 GHz) 3.3V Max 450 mA VDDIO_RF Avg 200 mA 4.7 µF 0402 WL OTP 3.3V 2.5V Internal LNLDO 2.5V WL RF – RX, TX, NMOS miniPMU LDOs 10 mA 2.5V Internal LNLDO 2.5V WL RF – VCO 25 mA 2.5V 2.5V Internal LNLDO WL RF – CP 8 mA Power switch No dedicated power switch, but internal power-down modes and No power switch block-specific power switches. Document Number: 002-15051 Rev. *O Page 9 of 121 Document Outline 1. CYW43455 Overview 1.1 Overview 1.2 Standards Compliance 2. Power Supplies and Power Management 2.1 Power Supply Topology 2.2 CYW43455 PMU Features 2.3 WLAN Power Management 2.4 PMU Sequencing Each resource is in one of four states: 2.5 Power-Off Shutdown 2.6 Power-Up/Power-Down/Reset Circuits 3. Frequency References 3.1 Crystal Interface and Clock Generation 3.2 External Frequency Reference 3.3 Frequency Selection 3.4 External 32.768 kHz Low-Power Oscillator 4. Bluetooth Subsystem Overview 4.1 Features 4.2 Bluetooth Radio 4.2.1 Transmit 4.2.2 Digital Modulator 4.2.3 Digital Demodulator and Bit Synchronizer 4.2.4 Power Amplifier 4.2.5 Receiver 4.2.6 Digital Demodulator and Bit Synchronizer 4.2.7 Receiver Signal Strength Indicator 4.2.8 Local Oscillator Generation 4.2.9 Calibration 5. Bluetooth Baseband Core 5.1 Bluetooth 4.0 Features 5.2 Bluetooth 4.2 Features 5.3 Bluetooth Low Energy 5.4 Bluetooth 5.0 5.5 Link Control Layer 5.6 Test Mode Support 5.7 Bluetooth Power Management Unit 5.7.1 RF Power Management 5.7.2 Host Controller Power Management 5.7.3 BBC Power Management 5.8 Adaptive Frequency Hopping 5.9 Advanced Bluetooth/WLAN Coexistence 5.10 Fast Connection (Interlaced Page and Inquiry Scans) 6. Microprocessor and Memory Unit for Bluetooth 6.1 RAM, ROM, and Patch Memory 6.2 Reset 7. Bluetooth Peripheral Transport Unit 7.1 SPI Interface 7.2 SPI/UART Transport Detection 7.3 PCM Interface 7.3.1 Slot Mapping 7.3.2 Frame Synchronization 7.3.3 Data Formatting 7.3.4 Wideband Speech Support 7.3.5 Multiplexed Bluetooth Over PCM 7.3.6 Burst PCM Mode 7.3.7 PCM Interface Timing 7.4 UART Interface 7.5 I2S Interface 7.5.1 I2S Timing 8. WLAN Global Functions 8.1 WLAN CPU and Memory Subsystem 8.2 One-Time Programmable Memory 8.3 GPIO Interface 8.4 External Coexistence Interface 8.5 UART Interface 8.6 JTAG/SWD Interface 9. WLAN Host Interfaces 9.1 SDIO v3.0 9.2 SDIO Pins 9.3 PCI Express Interface 9.4 Transaction Layer Interface 9.4.1 Data Link Layer 9.4.2 Physical Layer 9.4.3 Logical Subblock 9.4.4 Scrambler/Descrambler 9.4.5 8B/10B Encoder/Decoder 9.4.6 Elastic FIFO 9.4.7 Electrical Subblock 9.4.8 Configuration Space 10. Wireless LAN MAC and PHY 10.1 IEEE 802.11ac MAC 10.1.1 PSM 10.1.2 WEP 10.1.3 TXE 10.1.4 RXE 10.1.5 IFS 10.1.6 TSF 10.1.7 NAV 10.1.8 MAC-PHY Interface 10.2 IEEE 802.11ac PHY 11. WLAN Radio Subsystem 11.1 Receiver Path 11.2 Transmit Path 11.3 Calibration 12. Ball Map and Pin Descriptions 12.1 Ball Map 12.2 Pin List by Pin Number 12.3 Pin List by Pin Name 12.4 Pin Descriptions 12.5 WLAN GPIO Signals and Strapping Options 12.5.1 Multiplexed Bluetooth GPIO Signals 12.6 I/O States 13. DC Characteristics 13.1 Absolute Maximum Ratings 13.2 Environmental Ratings 13.3 Electrostatic Discharge Specifications 13.4 Recommended Operating Conditions and DC Characteristics 14. Bluetooth RF Specifications 15. WLAN RF Specifications 15.1 Introduction 15.2 2.4 GHz Band General RF Specifications 15.3 WLAN 2.4 GHz Receiver Performance Specifications 15.4 WLAN 2.4 GHz Transmitter Performance Specifications 15.5 WLAN 5 GHz Receiver Performance Specifications 15.6 WLAN 5 GHz Transmitter Performance Specifications 15.7 General Spurious Emissions Specifications 15.7.1 Transmitter Spurious Emissions Specifications 15.7.2 Receiver Spurious Emissions Specifications 16. Internal Regulator Electrical Specifications 16.1 Core Buck Switching Regulator 16.2 3.3V LDO (LDO3P3) 16.3 2.5V LDO (BTLDO2P5) 16.4 CLDO 16.5 LNLDO 16.6 PCIe LDO 17. System Power Consumption 17.1 WLAN Current Consumption 17.1.1 2.4 GHz Mode 17.1.2 5 GHz Mode 17.2 Bluetooth Current Consumption 18. Interface Timing and AC Characteristics 18.1 SDIO Timing 18.1.1 SDIO Default Mode Timing 18.2 SDIO High-Speed Mode Timing 18.2.1 SDIO Bus Timing Specifications in SDR Modes 18.2.2 SDIO Bus Timing Specifications in DDR50 Mode 18.3 PCI Express Interface Parameters 18.4 JTAG Timing 18.5 SWD Timing 19. Power-Up Sequence and Timing 19.1 Sequencing of Reset and Regulator Control Signals 19.1.1 Description of Control Signals 19.1.2 Control Signal Timing Diagrams 20. Package Information 20.1 Package Thermal Characteristics 20.2 Junction Temperature Estimation and PSIJT Versus THETAJC 20.3 Environmental Characteristics 21. Mechanical Information 22. Ordering Information 23. Additional Information 23.1 Acronyms and Abbreviations 23.2 References 23.3 IoT Resources Document History Page Sales, Solutions, and Legal Information Worldwide Sales and Design Support Products PSoC® Solutions Cypress Developer Community Technical Support