Datasheet NXH010P120MNF1PTNG, NXH010P120MNF1PNG (ON Semiconductor) - 4

FabricanteON Semiconductor
DescripciónF1-2PACK SiC MOSFET Module
Páginas / Página12 / 4 — NXH010P120MNF1PTNG, NXH010P120MNF1PNG. ELECTRICAL CHARACTERISTICS. …
RevisiónP2
Formato / tamaño de archivoPDF / 2.2 Mb
Idioma del documentoInglés

NXH010P120MNF1PTNG, NXH010P120MNF1PNG. ELECTRICAL CHARACTERISTICS. Parameter. Test Conditions. Symbol. Min. Typ. Max. Unit

NXH010P120MNF1PTNG, NXH010P120MNF1PNG ELECTRICAL CHARACTERISTICS Parameter Test Conditions Symbol Min Typ Max Unit

Línea de modelo para esta hoja de datos

Versión de texto del documento

NXH010P120MNF1PTNG, NXH010P120MNF1PNG ELECTRICAL CHARACTERISTICS
(continued) TJ = 25°C unless otherwise noted
Parameter Test Conditions Symbol Min Typ Max Unit SiC MOSFET CHARACTERISTICS
Total Gate Charge VDS = 800 V. VGS = 20 V. QG(TOTAL) – 454 – nC ID = 100 A Gate−Source Charge QGS – 129 – nC Gate−Drain Charge QGD – 131 – nC Turn−on Delay Time TJ = 25°C td(on) – 44.2 – ns VDS = 600 V, ID = 100 A Rise Time V tr – 16.2 – GS = −5V/18V, RG = 2 W Turn−off Delay Time td(off) – 136.6 – Fall Time tf – 9.8 – Turn−on Switching Loss per Pulse EON – 0.95 – mJ Turn off Switching Loss per Pulse EOFF – 0.72 – Turn−on Delay Time TJ = 150°C td(on) – 40.2 – ns VDS = 600 V, ID = 100 A Rise Time V tr – 14.9 – GS = −5V/18V, RG = 2 W Turn−off Delay Time td(off) – 150.3 – Fall Time tf – 12.7 – Turn−on Switching Loss per Pulse EON – 1.1 – mJ Turn off Switching Loss per Pulse EOFF – 0.81 – Diode Forward Voltage ID = 100 A
,
TJ = 25°C VSD – 3.94 6 V ID = 100 A
,
TJ = 150°C – 3.42 – Reverse Recovery Time TJ = 25°C trr – 24.2 – ns VDS = 600 V, ID = 100 A Reverse Recovery Charge Qrr – 1207 – nC VGS = −5V/18V, RG = 2 W Peak Reverse Recovery Current IRRM – 79.8 – A Peak Rate of Fall of Recovery Current di/dt – 7570 – A/ms Reverse Recovery Energy Err – 516 – mJ Reverse Recovery Time TJ = 150°C trr – 31.2 – ns VDS = 600 V, ID = 100 A Reverse Recovery Charge Qrr – 2591 – mC VGS = −5V/18V, RG = 2 W Peak Reverse Recovery Current IRRM – 134.2 – A Peak Rate of Fall of Recovery Current di/dt – 11849 – A/ms Reverse Recovery Energy Err – 1198 – mJ Thermal Resistance − chip−to−case M1,M2 RthJC – 0.23 – °C/W Thermal Resistance − chip−to−heatsink Thermal Resistance − chip−to− RthJH – 0.38 – °C/W heatsink, Thermal grease, Thickness = 2 Mil _2%, A = 2.8 W/mK
THERMISTOR CHARACTERISTICS
Nominal resistance T = 25°C R25 – 5 – kW Nominal resistance T = 100°C R100 – 457 – W Deviation of R25 ΔR/R −3 – 3 % Power dissipation PD – 50 – mW Power dissipation constant – 5 – mW/K B−value B(25/50), tolerance ±3% – 3375 – K B−value B(25/100), tolerance ±3% – 3455 – K
www.onsemi.com 4