Datasheet TMP114 (Texas Instruments)

TMP114
SNIS214 – JUNE 2021
TMP114 Ultra-Thin, 1.2-V to 1.8-V Supply, High Accuracy Digital Temperature Sensor with I2C Interface 1 Features 3 Description
• High Accuracy The TMP114 is a high accuracy, I2C-compatible – ±0.3 °C maximum from –10 °C to +85 °C digital output temperature sensor in an ultra-thin (0.15 – ±0.5 °C maximum from –40 °C to +125 °C mm) 4-pin package. With a low height package, the – ±0.1 °C typical TMP114 can be put under surface mount components • Operating Remperature Range: –40 °C to +125 °C for the fastest and most accurate temperature • 16-bit Resolution: 0.0078 °C (LSB) measurement and supports the latest thin form factor • Low Power Consumption: systems. – 0.7-µA Average Supply Current The TMP114 has an accuracy of ±0.3 °C and offers – 0.16-µA Shutdown Current an on-chip 16-bit analog-to-digital converter (ADC) • Supply Range of 1.08 V to 1.98 V that provides a temperature resolution of 0.0078 °C. • 1.2-V Compatible Logic Inputs Regardless of
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Rupply The TMP114 is designed to operate from a supply • I2C and SMBus Compatible Interface voltage range of 1.08 V to 1.98 V, with a low average
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• Optional Cyclic Redundancy Check (CRC) supply current of less than 0.7 µA. The low supply
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Checksum support, along with extremely low power consumption, • Temperature Alert Status with Hysteresis is designed for battery-powered applications. The • NIST Traceability TMP114 is 100% tested on a production setup that • Ultra-Thin 4-Ball PicoStar (DSBGA) Package is NIST traceable.
2 Applications Device Information PART NUMBER PACKAGE BODY SIZE (NOM)
• Mobile phones 0.758 mm × 0.758 • Solid state drives (SSDs) TMP114 PicoStar (4)
NCE INFO
mm • Wearable fitness & activity monitors
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• Portable electronics
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• Set-top boxes (STBs) 1.08 V to 1.98 V • Connected peripherals & printers
AD
1.2 kΩ 1.2 kΩ 0.1 µF VDD SCL SCL
I2C TMP114 Controller
SDA SDA GND
Simplified Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change without notice. Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 I2C Interface Timing 6.7 Two-Wire Timing Diagram 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Cyclic Redundancy Check (CRC) 7.3.2 Temperature Limits 7.3.3 Slew Rate Warning 7.3.4 NIST Traceability 7.4 Device Functional Modes 7.4.1 Continuous Conversion Mode 7.4.2 Shutdown Mode 7.4.2.1 One-Shot Temperature Conversions 7.5 Programming 7.5.1 Temperature Data Format 7.5.2 I2C and SMBus Interface 7.5.3 Device Address 7.5.4 Bus Transactions 7.5.4.1 Auto-Increment 7.5.4.2 Writes 7.5.4.2.1 CRC Enabled Writes 7.5.4.3 Reads 7.5.4.3.1 CRC Enabled Reads 7.5.4.4 General Call Reset Function 7.5.4.5 Time-Out Function 7.5.4.6 I2C in I3C Mixed Fast Mode 7.5.4.7 Cyclic Redundancy Check Implementation 7.6 Register Map 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Receiving Notification of Documentation Updates 11.2 Support Resources 11.3 Trademarks 11.4 Electrostatic Discharge Caution 11.5 Glossary 12 Mechanical, Packaging, and Orderable Information 12.1 Tape and Reel Information