Datasheet IGI60F1414A1L (Infineon) - 2

Product brief CoolGaN™ IPS half-bridge 600 V Ease of use with integrated drivers for highest efficiency and power density
Pin configuration and exposed pads for Pin description QFN-28 8 x 8 mm package, top view (not to scale) Pin number Symbol Description 1
– Do not connect (floating)
2
OUTH Driver output high-side SW NC ENABLE GNDI VDDI SLDON INH
3
VDDH Supply voltage for high-side driver (typ. 8 V referred to SW) 28 27 26 25 24 23 22
4
GH Gate connection high-side switch NC 1 21 INL
5-8, 28
SW Half-bridge output (switching node) GNDI OUTH 2 20 GNDI
9-11
DH Drain connection high-side switch
12-16
SL Source connection low-side switch VDDH 3 19 OUTL
17
GL Gate connection low-side switch GH 4 18 VDDL
18
VDDL Supply voltage for low-side driver (typ. 8 V referred to SL) SW 5 17 GL
19
OUTL Driver output low-side SW SW 6 16 SL
20, 25
GNDI Ground connection of driver Input stage SL SW 7 15 SL
21
INL Input signal (default state “Low”); controls low-side switch
22
INH Input signal (default state “Low”): controls high-side switch SW 8 14 SL
23
SLDON Connected to VDDI (or not connected): VDDI directly supplies 13 SL driver input circuitry Connected to GNDI: Internal shunt regulator activated to generate VDDI (3.3 V) 9
24
VDDI Supply voltage driver input stage (+3.3 V); can be either applied 10 11 12 directly or generated by internal SLDO (e.g by connecting VDDI via resistor R DH DH DH SL VDD1 to VDDL)
26
ENABLE Input signal (default state “Low” - both outputs set to low slate); logic “High” required to activate outputs
27
– Do not connect (floating)
CoolGaN™ IPS half-bridge 600 V product portfolio RDS(on) typ. 8x8mm QFN-28 package 6x8mm QFN-26 package 140 mΩ
IGI60F1414A1L
200 mΩ
IGI60F2020A1L
270 mΩ
IGI60F2727A1L IGI60F2727A1M
500 mΩ
IGI60F5050A1L Sampling/available Published by
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