Datasheet AIS2IH (STMicroelectronics) - 9
| Fabricante | STMicroelectronics |
| Descripción | MEMS digital output motion sensor: high-performance 3-axis accelerometer for automobile applications |
| Páginas / Página | 63 / 9 — AIS2IH. Communication interface characteristics. 2.4. 2.4.1. SPI - serial … |
| Formato / tamaño de archivo | PDF / 1.6 Mb |
| Idioma del documento | Inglés |
AIS2IH. Communication interface characteristics. 2.4. 2.4.1. SPI - serial peripheral interface. Table 6. SPI slave timing values
Línea de modelo para esta hoja de datos
Versión de texto del documento
link to page 9
AIS2IH Communication interface characteristics 2.4 Communication interface characteristics 2.4.1 SPI - serial peripheral interface
Subject to general operating conditions for Vdd and Top.
Table 6. SPI slave timing values Value (1) Symbol Parameter Unit Min Max
tc(SPC) SPI clock cycle 100 ns fc(SPC) SPI clock frequency 10 MHz tsu(CS) CS setup time 6 th(CS) CS hold time 8 tsu(SI) SDI input setup time 12 th(SI) SDI input hold time 15 ns tv(SO) SDO valid output time 50 th(SO) SDO output hold time 9 tdis(SO) SDO output disable time 50 1. 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not tested in production.
Figure 3. SPI slave timing diagram
CS t t su(CS) c(SPC) th(CS) SPC tsu(SI) th(SI) SDI MSB IN LSB IN tv(SO) th(SO) tdis(SO) SDO MSB OUT LSB OUT Note: Measurement points are done at 0.3·Vdd_IO and 0.7·Vdd_IO for both input and output ports.
DS12421
-
Rev 4 page 9/63
Document Outline Features Applications Description 1 Block diagram and pin description 1.1 Block diagram 1.2 Pin description 2 Mechanical and electrical specifications 2.1 Mechanical characteristics 2.2 Electrical characteristics 2.3 Temperature sensor characteristics 2.4 Communication interface characteristics 2.4.1 SPI - serial peripheral interface 2.4.2 I²C - inter-IC control interface 2.5 Absolute maximum ratings 3 Terminology and functionality 3.1 Terminology 3.1.1 Sensitivity 3.1.2 Zero-g level offset 3.2 Functionality 3.2.1 Operating modes 3.2.2 Single data conversion on-demand mode 3.2.3 Self-test 3.2.4 Activity/Inactivity, stationary/motion detection functions 3.2.5 High tap/double-tap user configurability 3.2.6 Offset management 3.3 Sensing element 3.4 IC interface 3.5 Factory calibration 3.6 Temperature sensor 4 Application hints 5 Digital main blocks 5.1 Block diagram of filters 5.2 Data stabilization time vs. ODR/device setting 5.3 FIFO 5.3.1 Bypass mode 5.3.2 FIFO mode 5.3.3 Continuous mode 5.3.4 Continuous-to-FIFO mode 5.3.5 Bypass-to-Continuous mode 6 Digital interfaces 6.1 I²C serial interface 6.1.1 I²C operation 6.2 SPI bus interface 6.2.1 SPI read 6.2.2 SPI write 6.2.3 SPI read in 3-wire mode 7 Register mapping 8 Register description 8.1 OUT_T_L (0Dh) 8.2 OUT_T_H (0Eh) 8.3 WHO_AM_I (0Fh) 8.4 CTRL1 (20h) 8.5 CTRL2 (21h) 8.6 CTRL3 (22h) 8.7 CTRL4_INT1_PAD_CTRL (23h) 8.8 CTRL5_INT2_PAD_CTRL (24h) 8.9 CTRL6 (25h) 8.10 OUT_T (26h) 8.11 STATUS (27h) 8.12 OUT_X_L (28h) 8.13 OUT_X_H (29h) 8.14 OUT_Y_L (2Ah) 8.15 OUT_Y_H (2Bh) 8.16 OUT_Z_L (2Ch) 8.17 OUT_Z_H (2Dh) 8.18 FIFO_CTRL (2Eh) 8.19 FIFO_SAMPLES (2Fh) 8.20 TAP_THS_X (30h) 8.21 TAP_THS_Y (31h) 8.22 TAP_THS_Z (32h) 8.23 INT_DUR (33h) 8.24 WAKE_UP_THS (34h) 8.25 WAKE_UP_DUR (35h) 8.26 FREE_FALL (36h) 8.27 STATUS_DUP (37h) 8.28 WAKE_UP_SRC (38h) 8.29 TAP_SRC (39h) 8.30 SIXD_SRC (3Ah) 8.31 ALL_INT_SRC (3Bh) 8.32 X_OFS_USR (3Ch) 8.33 Y_OFS_USR (3Dh) 8.34 Z_OFS_USR (3Eh) 8.35 CTRL7 (3Fh) 9 Package information 9.1 Soldering information 9.2 LGA-12 package information 9.3 LGA-12 packing information Revision history Contents List of tables List of figures
AIS2IH Communication interface characteristics 2.4 Communication interface characteristics 2.4.1 SPI - serial peripheral interface
Subject to general operating conditions for Vdd and Top.
Table 6. SPI slave timing values Value (1) Symbol Parameter Unit Min Max
tc(SPC) SPI clock cycle 100 ns fc(SPC) SPI clock frequency 10 MHz tsu(CS) CS setup time 6 th(CS) CS hold time 8 tsu(SI) SDI input setup time 12 th(SI) SDI input hold time 15 ns tv(SO) SDO valid output time 50 th(SO) SDO output hold time 9 tdis(SO) SDO output disable time 50 1. 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not tested in production.
Figure 3. SPI slave timing diagram
CS t t su(CS) c(SPC) th(CS) SPC tsu(SI) th(SI) SDI MSB IN LSB IN tv(SO) th(SO) tdis(SO) SDO MSB OUT LSB OUT Note: Measurement points are done at 0.3·Vdd_IO and 0.7·Vdd_IO for both input and output ports.
DS12421
-
Rev 4 page 9/63
Document Outline Features Applications Description 1 Block diagram and pin description 1.1 Block diagram 1.2 Pin description 2 Mechanical and electrical specifications 2.1 Mechanical characteristics 2.2 Electrical characteristics 2.3 Temperature sensor characteristics 2.4 Communication interface characteristics 2.4.1 SPI - serial peripheral interface 2.4.2 I²C - inter-IC control interface 2.5 Absolute maximum ratings 3 Terminology and functionality 3.1 Terminology 3.1.1 Sensitivity 3.1.2 Zero-g level offset 3.2 Functionality 3.2.1 Operating modes 3.2.2 Single data conversion on-demand mode 3.2.3 Self-test 3.2.4 Activity/Inactivity, stationary/motion detection functions 3.2.5 High tap/double-tap user configurability 3.2.6 Offset management 3.3 Sensing element 3.4 IC interface 3.5 Factory calibration 3.6 Temperature sensor 4 Application hints 5 Digital main blocks 5.1 Block diagram of filters 5.2 Data stabilization time vs. ODR/device setting 5.3 FIFO 5.3.1 Bypass mode 5.3.2 FIFO mode 5.3.3 Continuous mode 5.3.4 Continuous-to-FIFO mode 5.3.5 Bypass-to-Continuous mode 6 Digital interfaces 6.1 I²C serial interface 6.1.1 I²C operation 6.2 SPI bus interface 6.2.1 SPI read 6.2.2 SPI write 6.2.3 SPI read in 3-wire mode 7 Register mapping 8 Register description 8.1 OUT_T_L (0Dh) 8.2 OUT_T_H (0Eh) 8.3 WHO_AM_I (0Fh) 8.4 CTRL1 (20h) 8.5 CTRL2 (21h) 8.6 CTRL3 (22h) 8.7 CTRL4_INT1_PAD_CTRL (23h) 8.8 CTRL5_INT2_PAD_CTRL (24h) 8.9 CTRL6 (25h) 8.10 OUT_T (26h) 8.11 STATUS (27h) 8.12 OUT_X_L (28h) 8.13 OUT_X_H (29h) 8.14 OUT_Y_L (2Ah) 8.15 OUT_Y_H (2Bh) 8.16 OUT_Z_L (2Ch) 8.17 OUT_Z_H (2Dh) 8.18 FIFO_CTRL (2Eh) 8.19 FIFO_SAMPLES (2Fh) 8.20 TAP_THS_X (30h) 8.21 TAP_THS_Y (31h) 8.22 TAP_THS_Z (32h) 8.23 INT_DUR (33h) 8.24 WAKE_UP_THS (34h) 8.25 WAKE_UP_DUR (35h) 8.26 FREE_FALL (36h) 8.27 STATUS_DUP (37h) 8.28 WAKE_UP_SRC (38h) 8.29 TAP_SRC (39h) 8.30 SIXD_SRC (3Ah) 8.31 ALL_INT_SRC (3Bh) 8.32 X_OFS_USR (3Ch) 8.33 Y_OFS_USR (3Dh) 8.34 Z_OFS_USR (3Eh) 8.35 CTRL7 (3Fh) 9 Package information 9.1 Soldering information 9.2 LGA-12 package information 9.3 LGA-12 packing information Revision history Contents List of tables List of figures