Datasheet LNK3202, LNK3204-7, LNK3294, LNK3296 (Power Integrations) - 22
| Fabricante | Power Integrations |
| Descripción | Highly Energy Efficient Off-line Switcher IC with Integrated System Level Protection for Low Component-Count Power Supplies |
| Páginas / Página | 28 / 22 — LinkSwitch-TN2. SMD-8C (G Package). Notes:. D S .004 (.10). .046 .060 … |
| Formato / tamaño de archivo | PDF / 2.6 Mb |
| Idioma del documento | Inglés |
LinkSwitch-TN2. SMD-8C (G Package). Notes:. D S .004 (.10). .046 .060 .060 .046. 1. Controlling dimensions are
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LinkSwitch-TN2 SMD-8C (G Package) Notes:
⊕
D S .004 (.10) .046 .060 .060 .046 1. Controlling dimensions are inches. Millimeter sizes are -E- shown in parentheses. .080 2. Dimensions shown do not include mold flash or other protrusions. Mold flash or .086 protrusions shall not exceed .006 (.15) on any side. .372 (9.45) .186 .240 (6.10) 3. Pin locations start with Pin 1, .388 (9.86) .260 (6.60) .286 .420 and continue counter-clock-
⊕
E S .010 (.25) wise to Pin 8 when viewed from the top. Pin 3 is omitted. 4. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm). Pin 1 Pin 1 5. Lead width measured at .137 (3.48) package body. MINIMUM Solder Pad Dimensions 6. D and E are referenced .100 (2.54) (BSC) datums on the package body. .356 (9.05) -D- .387 (9.83) .057 (1.45) .125 (3.18) .068 (1.73) .145 (3.68) (NOTE 5) .004 (.10) .032 (.81) .048 (1.22) .009 (.23) .043 (1.09) .068 (1.73) .004 (.10) .036 (0.91) 0 -
°
8
°
.012 (.30) .044 (1.12) G08C
PI-4015b-072320
22
Rev. M 10/20 www.power.com Document Outline Product Highlights Description Output Current Table Pin Functional Description LinkSwitch-TN2 Functional Description Applications Example Key Application Considerations Quick Design Checklist Absolute Maximum Ratings Thermal Resistance Key Electrical Characteristics Typical Performance Characteristics PDIP-8C (P Package) SMD-8C (G Package) SO-8C (D Package) PDIP-8C (P) and SMD-8C Package Marking SO-8C (D) Package Marking MSL Table ESD and Latch-Up Part Ordering Information
⊕
D S .004 (.10) .046 .060 .060 .046 1. Controlling dimensions are inches. Millimeter sizes are -E- shown in parentheses. .080 2. Dimensions shown do not include mold flash or other protrusions. Mold flash or .086 protrusions shall not exceed .006 (.15) on any side. .372 (9.45) .186 .240 (6.10) 3. Pin locations start with Pin 1, .388 (9.86) .260 (6.60) .286 .420 and continue counter-clock-
⊕
E S .010 (.25) wise to Pin 8 when viewed from the top. Pin 3 is omitted. 4. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm). Pin 1 Pin 1 5. Lead width measured at .137 (3.48) package body. MINIMUM Solder Pad Dimensions 6. D and E are referenced .100 (2.54) (BSC) datums on the package body. .356 (9.05) -D- .387 (9.83) .057 (1.45) .125 (3.18) .068 (1.73) .145 (3.68) (NOTE 5) .004 (.10) .032 (.81) .048 (1.22) .009 (.23) .043 (1.09) .068 (1.73) .004 (.10) .036 (0.91) 0 -
°
8
°
.012 (.30) .044 (1.12) G08C
PI-4015b-072320
22
Rev. M 10/20 www.power.com Document Outline Product Highlights Description Output Current Table Pin Functional Description LinkSwitch-TN2 Functional Description Applications Example Key Application Considerations Quick Design Checklist Absolute Maximum Ratings Thermal Resistance Key Electrical Characteristics Typical Performance Characteristics PDIP-8C (P Package) SMD-8C (G Package) SO-8C (D Package) PDIP-8C (P) and SMD-8C Package Marking SO-8C (D) Package Marking MSL Table ESD and Latch-Up Part Ordering Information