Datasheet SLG46811 (Dialog Semiconductor) - 10

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SLG46811 GreenPAK Programmable Mixed-Signal Matrix Preliminary Table 1: Functional Pin Description
(Continued)
STQFN Pin Signal Input Output Function 12 Pin # Name Name Options Options
Digital Input Push-Pull (1x) (2x) without Schmitt Trigger General Purpose IO GPIO Digital Input Open-Drain NMOS with OE
(Note 1)
with Schmitt Trigger (1x) (2x) Low Voltage Digital Input -- 11 GPIO7 Positive Input 3 of MS ACMP In 3 Analog -- MS ACMP Slave -- -- Address 3 External Clock External Clock Connection -- -- of OSC1 Digital Input Push-Pull (1x) (2x) without Schmitt Trigger General Purpose IO 12 GPIO8 GPIO Digital Input Open-Drain NMOS with OE
(Note 1)
with Schmitt Trigger (1x) (2x) Low Voltage Digital Input --
Note 1
General Purpose IO's with OE can be used to implement bidirectional signals under user control via Connection Matrix to OE signal in IO structure or as a 3-state output.
Table 2: Pin Type Definitions Pin Type Description
VDD Power Supply GPI General Purpose Input GPIO General Purpose Input/Output GND Ground
Datasheet Revision 2.2 3-Feb-2021
CFR0011-120-00 10 of 168 © 2021 Dialog Semiconductor Document Outline General Description Key Features Applications 1 Block Diagram 2 Pinout 2.1 Pin Configuration - STQFN- 12 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Electrostatic Discharge Ratings 3.3 Recommended Operating Conditions 3.4 Electrical Characteristics 3.5 I2C Pins Electrical Characteristics 3.6 Macrocells Current Consumption 3.7 Timing Characteristics 3.8 Counter/Delay Characteristics 3.9 Oscillator Characteristics 3.9.1 OSC Power-On Delay 3.10 MS ACMP Characteristics 3.11 Analog Temperature Sensor Characteristics 4 User Programmability 5 IO Pins 5.1 GPIO Pins 5.2 GPI Pins 5.3 Pull-Up/Down Resistors 5.4 Fast Pull-up/down during Power-up 5.5 GPI Structure 5.5.1 GPI Structure (for GPI) 5.6 GPIO with I2C Mode IO Structure 5.6.1 GPIO with I2C Mode Structure (for GPIO0 and GPIO1) 5.7 Matrix OE IO Structure 5.7.1 Matrix OE IO Structure (for GPIO2, GPIO3, GPIO7, GPIO8) 5.8 Register OE IO Structure 5.8.1 Register OE IO Structure (for GPIO4, GPIO5, GPIO6) 5.9 IO Typical Performance 6 Connection Matrix 6.1 Matrix Input Table 6.2 Matrix Output Table 6.3 Connection Matrix Virtual Inputs 6.4 Connection Matrix Virtual Outputs 7 Combination Function Macrocells 7.1 2-Bit LUT or D Flip-Flop Macrocells 7.1.1 2-Bit LUT or D Flip-Flop Macrocell Used as 2-Bit LUT 7.2 2-bit LUT or Programmable Pattern Generator 7.3 3-Bit LUT or D Flip-Flop with Set/Reset Macrocells Or Shift Register Macrocells 7.3.1 3-Bit LUT or D Flip-Flop Macrocells Used as 3-Bit LUTs 7.4 3-Bit LUT or D Flip-Flop with Set/Reset Macrocells 7.5 4-Bit LUT or D Flip-Flop with Set/Reset Macrocell 7.5.1 4-Bit LUT Macrocell Used as 4-Bit LUT 8 Multi-Function Macrocells 8.1 3-Bit LUT or DFF/Latch with 8-Bit Counter/Delay Macrocells 8.1.1 3-Bit LUT or 8-Bit CNT/DLY Block Diagrams 8.1.2 3-Bit LUT or CNT/DLYs Used as 3-Bit LUTs 8.2 CNT/DLY Timing Diagrams 8.2.1 Delay Mode CNT/DLY0 to CNT/DLY5 8.2.2 Count Mode (Count Data: 3), Counter Reset (Rising Edge Detect) CNT/DLY0 to CNT/DLY5 8.2.3 One-Shot Mode CNT/DLY0 to CNT/DLY5 8.2.4 Frequency Detection Mode CNT/DLY0 to CNT/DLY5 8.2.5 Edge Detection Mode CNT/DLY1 to CNT/DLY5 8.2.6 Delayed Edge Detection Mode CNT/DLY0 to CNT/DLY5 8.2.7 Difference in Counter Value for Counter, Delay, One-Shot, and Frequency Detect Modes 8.3 FSM Timing Diagrams 9 Multichannel Sampling Analog Comparator 9.1 Multichannel Sampling ACMP Block Diagram 9.2 MS ACMP Timing Diagrams 9.3 ACMP Typical Performance 10 Programmable Delay/Edge Detector 10.1 Programmable Delay Timing Diagram - Edge Detector OUTPUT 11 Additional Logic Function. Deglitch Filter 12 Voltage Reference 12.1 Voltage Reference Overview 12.2 Vref Selection Table 13 Clocking 13.1 OSC General description 13.2 Oscillator0 (2.048 kHz/10 kHz) 13.3 Oscillator1 (25 MHz) 13.4 CNT/DLY Clock Scheme 13.5 External Clocking 13.5.1 GPI Source for Oscillator0 (2.048kHz/10 kHz) 13.5.2 GPIO Source for Oscillator1 (25 MHz) 13.6 Oscillators Power-On Delay 13.7 Oscillators Accuracy 14 Power-On Reset 14.1 General Operation 14.2 POR Sequence 14.3 Macrocells Output States During POR Sequence 14.3.1 Initialization 14.3.2 Power-Down 15 I2C Serial Communications Macrocell 15.1 I2C Serial Communications Macrocell Overview 15.2 I2C Serial Communications Device Addressing 15.3 I2C Serial General Timing 15.4 I2C Serial Communications Commands 15.4.1 Byte Write Command 15.4.2 Sequential Write Command 15.4.3 Current Address Read Command 15.4.4 Random Read Command 15.4.5 Sequential Read Command 15.4.6 I2C Serial Reset Command 15.5 I2C Serial Command Register Map 15.6 I2C Additional Options 15.6.1 I2C Byte Write Bit Masking 16 Extended Pattern Generator 17 Analog Temperature Sensor 18 Register Definitions 18.1 Register Map 19 Package Top Marking Definitions 19.1 STQFN 12L 1.6 mm x 1.6 mm 0.4P FC, before February 1, 2021 19.2 STQFN 12L 1.6 mm x 1.6 mm 0.4P FC, after February 1, 2021 20 Package Information 20.1 Package outlines FOR STQFN 12L 1.6 mm x 1.6 mm x 0.55 mm 0.4P FC Package 20.2 Moisture Sensitivity Level 20.3 Soldering Information 21 Ordering Information 21.1 Tape and Reel Specifications 21.2 Carrier Tape Drawing and Dimensions 22 Layout Guidelines 22.1 STQFN 12L 1.6 mm x 1.6 mm x 0.55 mm 0.4P FC Package Glossary Revision History