Datasheet AD8270 (Analog Devices) - 5

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Data Sheet AD8270 ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 4. Parameter Rating
The maximum safe power dissipation for the AD8270 is limited Supply Voltage ±18 V by the associated rise in junction temperature (TJ) on the die. At Output Short-Circuit Current See derating approximately 130°C, which is the glass transition temperature, curve in Figure 2 the plastic changes its properties. Even temporarily exceeding this Input Voltage Range ±V temperature limit may change the stresses that the package exerts S Storage Temperature Range −65°C to +130°C on the die, permanently shifting the parametric performance of the Specified Temperature Range −40°C to +85°C amplifiers. Exceeding a temperature of 130°C for an extended Package Glass Transition Temperature (T period of time can result in a loss of functionality. G) 130°C ESD The AD8270 has built-in, short-circuit protection that limits the Human Body Model 1 kV output current to approximately 100 mA (see Figure 19 for more Charge Device Model 1 kV information). While the short-circuit condition itself does not Machine Model 0.1 kV damage the device, the heat generated by the condition can cause Stresses at or above those listed under Absolute Maximum the device to exceed its maximum junction temperature, with Ratings may cause permanent damage to the product. This is a corresponding negative effects on reliability. stress rating only; functional operation of the product at these
3.2 T
or any other conditions above those indicated in the operational
J MAXIMUM = 130°C 2.8 )
section of this specification is not implied. Operation beyond
(W N
the maximum operating conditions for extended periods may
2.4 IO T PAD SOLDERED
affect product reliability.
PA θ 2.0 JA = 57°C/W THERMAL RESISTANCE ISSI D 1.6 ER Table 5. Thermal Resistance W 1.2 Thermal Pad θ M PO PAD NOT SOLDERED JA Unit θ MU 0.8 JA = 96°C/W
16-Lead LFCSP with Thermal Pad 57 °C/W
XI
Soldered to Board
MA 0.4
16-Lead LFCSP with Thermal Pad 96 °C/W Not Soldered to Board
0
003
–50 –25 0 25 50 75 100 125 AMBIENT TEMPERATURE (°C)
06979- The θ JA values in Table 5 assume a 4-layer JEDEC standard Figure 2. Maximum Power Dissipation vs. Ambient Temperature board with zero airflow. If the thermal pad is soldered to the board, it is also assumed it is connected to a plane. θ
ESD CAUTION
JC at the exposed pad is 9.7°C/W. Rev. A | Page 5 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DIFFERENCE AMPLIFIER CONFIGURATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION CIRCUIT INFORMATION DC Performance AC Performance Production Costs Size DRIVING THE AD8270 PACKAGE CONSIDERATIONS POWER SUPPLIES INPUT VOLTAGE RANGE APPLICATIONS INFORMATION DIFFERENCE AMPLIFIER CONFIGURATIONS SINGLE-ENDED CONFIGURATIONS Gain of 1 Configuration DIFFERENTIAL OUTPUT DRIVING AN ADC DRIVING CABLING OUTLINE DIMENSIONS ORDERING GUIDE