Datasheet AD8274 (Analog Devices) - 4

link to page 4 link to page 7 link to page 4 link to page 7
AD8274 ABSOLUTE MAXIMUM RATINGS Table 3. MAXIMUM POWER DISSIPATION Parameter Rating
The maximum safe power dissipation for the AD8274 is limited Supply Voltage ±18 V by the associated rise in junction temperature (TJ) on the die. At Maximum Voltage at Any Input Pin −VS + 40 V approximately 150°C, which is the glass transition temperature, Minimum Voltage at Any Input Pin +VS – 40 V the properties of the plastic change. Even temporarily exceeding Storage Temperature Range −65°C to +150°C this temperature limit may change the stresses that the package Specified Temperature Range −40°C to +85°C exerts on the die, permanently shifting the parametric performance Package Glass Transition Temperature (TG) 150°C of the amplifiers. Exceeding a temperature of 150°C for an extended period may result in a loss of functionality. Stresses above those listed under Absolute Maximum Ratings
2.0
may cause permanent damage to the device. This is a stress
TJ MAX = 150°C )
rating only; functional operation of the device at these or any
(W 1.6 N
other conditions above those indicated in the operational
IO T
section of this specification is not implied. Exposure to absolute
IPA SOIC S 1.2 θJA = 121°C/W
maximum rating conditions for extended periods may affect
IS D
device reliability.
R E MSOP W θJA = 135°C/W O 0.8 THERMAL RESISTANCE M P
The θ
MU
JA values in Table 4 assume a 4-layer JEDEC standard
XI 0.4
board with zero airflow.
MA
4 00 2-
Table 4. Thermal Resistance
36
0
07
–50 –25 0 25 50 75 100 125 Package Type θJA Unit AMBIENT TEMERATURE (°C)
8-Lead MSOP 135 °C/W Figure 2. Maximum Power Dissipation vs. Ambient Temperature 8-Lead SOIC 121 °C/W
SHORT-CIRCUIT CURRENT
The AD8274 has built-in, short-circuit protection that limits the output current (see Figure 16 for more information). While the short-circuit condition itself does not damage the part, the heat generated by the condition can cause the part to exceed its maximum junction temperature, with corresponding negative effects on reliability. Figure 2 and Figure 16, combined with knowledge of the part’s supply voltages and ambient temperature, can be used to determine whether a short circuit will cause the part to exceed its maximum junction temperature.
ESD CAUTION
Rev. C | Page 4 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION SHORT-CIRCUIT CURRENT ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTION TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION CIRCUIT INFORMATION DC Performance AC Performance Production Costs Size DRIVING THE AD8274 POWER SUPPLIES INPUT VOLTAGE RANGE CONFIGURATIONS DRIVING CABLING OUTLINE DIMENSIONS ORDERING GUIDE