Datasheet AD8271 (Analog Devices) - 6

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AD8271 ABSOLUTE MAXIMUM RATINGS Table 5. MAXIMUM POWER DISSIPATION Parameter Rating
The maximum safe power dissipation for the AD8271 is limited Supply Voltage ±18 V by the associated rise in junction temperature (TJ) on the die. At Output Short-Circuit Current See derating curve in approximately 150°C, which is the glass transition temperature, Figure 2 the properties of the plastic change. Even temporarily exceeding Input Voltage Range +VS + 0.4 V to this temperature limit may change the stresses that the package −VS − 0.4 V exerts on the die, permanently shifting the parametric perfor- Storage Temperature Range −65°C to +130°C mance of the amplifiers. Exceeding a temperature of 150°C for Specified Temperature Range −40°C to +85°C an extended period of time can cause changes in silicon devices, Package Glass Transition Temperature (TG) 150°C potentially resulting in a loss of functionality. ESD The AD8271 has built-in short-circuit protection that limits Human Body Model 1 kV the output current to approximately 100 mA (see Figure 22 for Charge Device Model 1 kV more information). Although the short-circuit condition itself Machine Model 0.1 kV does not damage the part, the heat generated by the condition can cause the part to exceed its maximum junction temperature, Stresses above those listed under Absolute Maximum Ratings with corresponding negative effects on reliability. may cause permanent damage to the device. This is a stress
1.6
rating only; functional operation of the device at these or any other conditions above those indicated in the operational
) 1.4 TJ MAX = 150°C W
section of this specification is not implied. Exposure to absolute
( N 1.2 O
maximum rating conditions for extended periods may affect
TI A P
device reliability.
1.0 ISSI THERMAL RESISTANCE D R 0.8 E W O Table 6. Thermal Resistance 0.6 P M Package Type θJA θJC Unit 0.4 XIMU
10-Lead MSOP 141.9 43.7 °C/W
MA 0.2
The θ
0
2 JA values in Table 6 assume a 4-layer JEDEC standard
–50 –25 0 25 50 75 100 125
103- board with zero airflow. 36
AMBIENT TEMPERATURE (C)
07 Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. 0 | Page 6 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DIFFERENCE AMPLIFIER CONFIGURATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION TYPICAL PERFORMANCE CHARACTERISTICS OPERATIONAL AMPLIFIER PLOTS THEORY OF OPERATION CIRCUIT INFORMATION DC Performance AC Performance Production Costs Size DRIVING THE AD8271 POWER SUPPLIES INPUT VOLTAGE RANGE APPLICATIONS INFORMATION DIFFERENCE AMPLIFIER CONFIGURATIONS SINGLE-ENDED CONFIGURATIONS Gain of 1 Configuration KELVIN MEASUREMENT INSTRUMENTATION AMPLIFIER DRIVING CABLING DRIVING AN ADC OUTLINE DIMENSIONS ORDERING GUIDE