Datasheet AD8278, AD8279 (Analog Devices) - 7

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AD8278/AD8279 ABSOLUTE MAXIMUM RATINGS 2.0 Table 6. TJ MAX = 150°C ) Parameter Rating (W 1.6 N
Supply Voltage ±18 V
IO T
Maximum Voltage at Any Input Pin −VS + 40 V
IPA SOIC S
Minimum Voltage at Any Input Pin +V
1.2 θJA = 121°C/W
S − 40 V
IS D
Storage Temperature Range −65°C to +150°C
R E MSOP θ
Specified Temperature Range −40°C to +85°C
W JA = 135°C/W O 0.8
Package Glass Transition Temperature (TG) 150°C
M P MU
Stresses above those listed under Absolute Maximum Ratings
XI 0.4 MA
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
0
2 other conditions above those indicated in the operational
–50 –25 0 25 50 75 100 125
00 8-
AMBIENT TEMERATURE (°C)
30 section of this specification is not implied. Exposure to absolute 08 maximum rating conditions for extended periods may affect Figure 3. Maximum Power Dissipation vs. Ambient Temperature device reliability.
SHORT-CIRCUIT CURRENT THERMAL RESISTANCE
The AD8278 and AD8279 have built-in, short-circuit protection The θ that limits the output current (see Figure 29 for more information). JA values in Table 7 assume a 4-layer JEDEC standard board with zero airflow. While the short-circuit condition itself does not damage the part, the heat generated by the condition can cause the part to
Table 7. Thermal Resistance
exceed its maximum junction temperature, with corresponding
Package Type θJA Unit
negative effects on reliability. Figure 3 and Figure 29, combined 8-Lead MSOP 135 °C/W with knowledge of the supply voltages and ambient temperature of 8-Lead SOIC 121 °C/W the part, can be used to determine whether a short circuit will 14-Lead SOIC 105 °C/W cause the part to exceed its maximum junction temperature.
MAXIMUM POWER DISSIPATION ESD CAUTION
The maximum safe power dissipation for the AD8278 and AD8279 are limited by the associated rise in junction tempera- ture (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the properties of the plastic change. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric performance of the amplifiers. Exceeding a temperature of 150°C for an extended period may result in a loss of functionality. Rev. C | Page 7 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION SHORT-CIRCUIT CURRENT ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION CIRCUIT INFORMATION DC Performance AC Performance DRIVING THE AD8278 AND AD8279 INPUT VOLTAGE RANGE POWER SUPPLIES APPLICATIONS INFORMATION CONFIGURATIONS DIFFERENTIAL OUTPUT INSTRUMENTATION AMPLIFIER OUTLINE DIMENSIONS ORDERING GUIDE