Datasheet ADA4830-1, ADA4830-2 (Analog Devices) - 6

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ADA4830-1/ADA4830-2 Data Sheet ABSOLUTE MAXIMUM RATINGS
The power dissipated in the package (PD) is the sum of the
Table 3.
quiescent power dissipation and the power dissipated in the
Parameter Rating
package due to the load drive for al outputs. The quiescent Supply Voltage (+VS Pin) 6 V power is the supply voltage (+VS) times the quiescent current (IS). Supply Voltage Delta The power dissipated due to load drive depends on the particular +VS1 to +VS2, ADA4830-2 Only 0.5 V application. The power due to load drive is calculated by Input Voltage Positive Direction (INNx, INPx) 22 V multiplying the load current by the associated voltage drop Input Voltage Negative Direction (INNx, INPx) −10 V across the device. RMS voltages and currents must be used Reference Voltage (VREFx Pin) +VS + 0.3 V in these calculations. Power Dissipation See Figure 3 Airflow increases heat dissipation, effectively reducing θ Storage Temperature Range −65°C to +150°C JA. Operating Temperature Range −40°C to +125°C Figure 3 shows the maximum power dissipation in the package vs. Lead Temperature (Soldering, 10 sec) 260°C the ambient temperature for the 8-lead LFCSP (116°C/W) and Junction Temperature 150°C the 16-lead LFCSP (54°C/W) on a JEDEC standard 4-layer board. θ Stresses above those listed under Absolute Maximum Ratings JA values are approximate. may cause permanent damage to the device. This is a stress
3.0
rating only; functional operation of the device at these or any
W) 2.5
other conditions above those indicated in the operational
(
section of this specification is not implied. Exposure to absolute
TION 2.0
maximum rating conditions for extended periods may affect
PA 16-LEAD LFCSP ISSI
device reliability.
D 1.5 ER THERMAL RESISTANCE W 8-LEAD LFCSP
θ
1.0 M PO
JA is specified for the device and its exposed paddle is soldered
MU
to a high thermal conductivity, 4-layer (2s2p) circuit board, as
XI
described in EIA/JESD 51-7.
0.5 MA Table 4. 0 0 10 20 30 40 50 60 70 80 90 100
050
Package Type θJA θJC Unit AMBIENT TEMPERATURE (°C)
10020- 8-Lead LFCSP 50 5 °C/W Figure 3. Maximum Power Dissipation vs. 16-Lead LFCSP 54 6 °C/W Ambient Temperature for a 4-Layer Board
MAXIMUM POWER DISSIPATION ESD CAUTION
The maximum safe power dissipation in the ADA4830-1 and ADA4830-2 packages is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Exceeding a junction temperature of 150°C for an extended time can result in changes in the silicon devices, potentially causing failure. Rev. C | Page 6 of 22 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications 5 V Operation 3.3 V Operation Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Theory of Operation Core Amplifier Overvoltage (Short-to-Battery) Protection Short-to-Battery Output Flag ESD Protection Power Supply Pins (ADA4830-2) Applications Information Methods of Transmission Pseudo Differential Mode (Unbalanced Source Termination) Pseudo Differential Mode (Balanced Source Impedance) Fully Differential Mode Voltage Reference (VREF Pin) Input Common-Mode Range Short-to-Battery Output Flag Pin Enable/Disable Modes (ENA Pin) PCB Layout Exposed Paddle (EPAD) Connection Using the ADA4830-2 as a Low Cost Video Switch Driving Capacitive Loads Typical Applications Circuits Fully DC-Coupled Transmission Line Packaging and Ordering Information Outline Dimensions Ordering Guide Automotive Products