HMC611LP4 / 611LP4E v04.0309 60 dB, LOGARITHMICDETECTOR / CONTROLLER, 1 - 10000 MHzOutline Drawing 12 T S - SM R O NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY T 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. C 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE E 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. T PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. E 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HMC APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN. R D E W O Package Information P Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] H611 HMC611LP4 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] H611 HMC611LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 12 - 53 Order On-line at www.hittite.com