Datasheet ADL6012 (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | 2 GHz to 67 GHz, 500 MHz Bandwidth Envelope Detector |
| Páginas / Página | 24 / 6 — ADL6012. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| Formato / tamaño de archivo | PDF / 713 Kb |
| Idioma del documento | Inglés |
ADL6012. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Thermal Resistance
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ADL6012 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage (VPOS to OCOM, RFCM) 5.5 V (PCB) design and operating environment. Careful attention to RFIN Input Signal Power1 PCB thermal design is required. Average 20 dBm θJA is the junction to ambient thermal impedance, and θJC is the Peak 23 dBm junction to case (exposed pad) thermal impedance. DC Voltage at RFIN, VOCM, ENBL −0.3 V to VPOS + 0.3 V Case Operating Temperature Range
Table 3. Thermal Resistance
ADL6012ACPZN −40°C to +105°C
Package Type1 θ 2 JA θJC Unit
ADL6012SCPZN −55°C to +125°C CP-10-12 74.69 11.64 °C/W Junction Temperature (T J) 150°C 1 Thermal impedance simulated value is based on no airflow with the exposed Storage Temperature Range −65°C to +150°C pad soldered to a 4-layer JEDEC board. Lead Temperature (Soldering, 60 sec) 300°C 2 θJC is the thermal impedance from junction to the exposed pad on the underside of the package. 1 Guaranteed by design. Not production tested. Stresses at or above those listed under Absolute Maximum
ESD CAUTION
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 6 of 24 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS MEASUREMENT SETUPS THEORY OF OPERATION BASIC CONNECTIONS RF INPUT ENVELOPE OUTPUT INTERFACE COMMON-MODE VOLTAGE INTERFACE ENABLE INTERFACE DECOUPLING INTERFACE PCB LAYOUT RECOMMENDATIONS SYSTEM CALIBRATION AND MEASUREMENT ERROR APPLICATIONS INFORMATION EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE
Thermal performance is directly linked to printed circuit board Supply Voltage (VPOS to OCOM, RFCM) 5.5 V (PCB) design and operating environment. Careful attention to RFIN Input Signal Power1 PCB thermal design is required. Average 20 dBm θJA is the junction to ambient thermal impedance, and θJC is the Peak 23 dBm junction to case (exposed pad) thermal impedance. DC Voltage at RFIN, VOCM, ENBL −0.3 V to VPOS + 0.3 V Case Operating Temperature Range
Table 3. Thermal Resistance
ADL6012ACPZN −40°C to +105°C
Package Type1 θ 2 JA θJC Unit
ADL6012SCPZN −55°C to +125°C CP-10-12 74.69 11.64 °C/W Junction Temperature (T J) 150°C 1 Thermal impedance simulated value is based on no airflow with the exposed Storage Temperature Range −65°C to +150°C pad soldered to a 4-layer JEDEC board. Lead Temperature (Soldering, 60 sec) 300°C 2 θJC is the thermal impedance from junction to the exposed pad on the underside of the package. 1 Guaranteed by design. Not production tested. Stresses at or above those listed under Absolute Maximum
ESD CAUTION
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 6 of 24 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS MEASUREMENT SETUPS THEORY OF OPERATION BASIC CONNECTIONS RF INPUT ENVELOPE OUTPUT INTERFACE COMMON-MODE VOLTAGE INTERFACE ENABLE INTERFACE DECOUPLING INTERFACE PCB LAYOUT RECOMMENDATIONS SYSTEM CALIBRATION AND MEASUREMENT ERROR APPLICATIONS INFORMATION EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE