Datasheet HMC487LP5E (Analog Devices) - 4
| Fabricante | Analog Devices |
| Descripción | SURFACE MOUNT PHEMT 2 WATT POWER AMPLIFIER, 9 - 12 GHz |
| Páginas / Página | 6 / 4 — HMC487LP5E. SURFACE MOUNT PHEMT 2 WATT POWER. AMPLIFIER, 9 - 12 GHz. … |
| Formato / tamaño de archivo | PDF / 957 Kb |
| Idioma del documento | Inglés |
HMC487LP5E. SURFACE MOUNT PHEMT 2 WATT POWER. AMPLIFIER, 9 - 12 GHz. Power Dissipation*. Typical Supply Current vs. Vdd
Línea de modelo para esta hoja de datos
Versión de texto del documento
HMC487LP5E
v03.0819
SURFACE MOUNT PHEMT 2 WATT POWER AMPLIFIER, 9 - 12 GHz Power Dissipation* Typical Supply Current vs. Vdd
11 Vdd (Vdc) Idd (mA) Max Pdiss @ +85C +6.5 1330 ) 10 T (W +7.0 1300 N IO 9 M +7.5 1285 PAT Note: Amplifier will operate over full voltage ranges shown 8 11 GHz ISSI above. Vgg adjusted to achieve Idd= 1300 mA at +7.0V. D ER 7
Absolute Maximum Ratings
R - S W E PO 6 Drain Bias Voltage (Vdd1, 2, 3, 4, 5) +8 Vdc W Gate Bias Voltage (Vgg) -2.0 to 0 Vdc 5 O RF Input Power (RFIN)(Vdd = +7.0 Vdc) +20 dBm -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 Channel Temperature 150 °C INPUT POWER (dBm) * Refer to “Thermal Management for Surface Mount Continuous Pdiss (T= 85 °C) 10 W Components” application note herein. (derate 154 mW/°C above 85 °C) R & P Thermal Resistance 6.5 °C/W (channel to ground paddle) A E Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE Operating Temperature -40 to +85 °C OBSERVE HANDLING PRECAUTIONS IN
32-Lead Lead Frame Chip Scale Package [LFCSP] 5 x 5 mm Body and 0.85 mm Package Height Outline Drawing (HCP-32-1) Dimensions shown in millimeters DETAIL A
S - L
(JEDEC 95)
R
5.10 0.30 5.00 SQ 0.25 PIN 1 INDICATOR 4.90 0.18
IE
PIN 1 INDICATOR AREA OPTIONS AREA (SEE DETAIL A) 25 32 24 1 0.50
LIF
BSC EXPOSED 3.80 PAD
P
3.70 SQ 3.60
M
17 8
A
16 9 0.45 0.20 MIN TOP VIEW BOTTOM VIEW 0.40 0.35 3.50 REF 0.90 0.85 FOR PROPER CONNECTION OF 0.05 MAX THE EXPOSED PAD, REFER TO 0.80 0.02 NOM THE PIN CONFIGURATION AND COPLANARITY FUNCTION DESCRIPTIONS SEATING 0.08 SECTION OF THIS DATA SHEET. PLANE 0.20 REF PKG-004898 COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4 02-19-2019-B
32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body and 0.85 mm Package Height (HCP-32-1) Dimensions shown in mil imeters
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC487LP5ETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 [1] H487 XXXX HMC487LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 [1] H487 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
4
v03.0819
SURFACE MOUNT PHEMT 2 WATT POWER AMPLIFIER, 9 - 12 GHz Power Dissipation* Typical Supply Current vs. Vdd
11 Vdd (Vdc) Idd (mA) Max Pdiss @ +85C +6.5 1330 ) 10 T (W +7.0 1300 N IO 9 M +7.5 1285 PAT Note: Amplifier will operate over full voltage ranges shown 8 11 GHz ISSI above. Vgg adjusted to achieve Idd= 1300 mA at +7.0V. D ER 7
Absolute Maximum Ratings
R - S W E PO 6 Drain Bias Voltage (Vdd1, 2, 3, 4, 5) +8 Vdc W Gate Bias Voltage (Vgg) -2.0 to 0 Vdc 5 O RF Input Power (RFIN)(Vdd = +7.0 Vdc) +20 dBm -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 Channel Temperature 150 °C INPUT POWER (dBm) * Refer to “Thermal Management for Surface Mount Continuous Pdiss (T= 85 °C) 10 W Components” application note herein. (derate 154 mW/°C above 85 °C) R & P Thermal Resistance 6.5 °C/W (channel to ground paddle) A E Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE Operating Temperature -40 to +85 °C OBSERVE HANDLING PRECAUTIONS IN
32-Lead Lead Frame Chip Scale Package [LFCSP] 5 x 5 mm Body and 0.85 mm Package Height Outline Drawing (HCP-32-1) Dimensions shown in millimeters DETAIL A
S - L
(JEDEC 95)
R
5.10 0.30 5.00 SQ 0.25 PIN 1 INDICATOR 4.90 0.18
IE
PIN 1 INDICATOR AREA OPTIONS AREA (SEE DETAIL A) 25 32 24 1 0.50
LIF
BSC EXPOSED 3.80 PAD
P
3.70 SQ 3.60
M
17 8
A
16 9 0.45 0.20 MIN TOP VIEW BOTTOM VIEW 0.40 0.35 3.50 REF 0.90 0.85 FOR PROPER CONNECTION OF 0.05 MAX THE EXPOSED PAD, REFER TO 0.80 0.02 NOM THE PIN CONFIGURATION AND COPLANARITY FUNCTION DESCRIPTIONS SEATING 0.08 SECTION OF THIS DATA SHEET. PLANE 0.20 REF PKG-004898 COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4 02-19-2019-B
32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body and 0.85 mm Package Height (HCP-32-1) Dimensions shown in mil imeters
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC487LP5ETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 [1] H487 XXXX HMC487LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 [1] H487 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
4