Datasheet HMC6981LS6 (Analog Devices) - 7

HMC6981LS6
v03.1018
GaAs pHEMT MMIC 2 WATT POWER AMPLIFIER, 15 - 20 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +6.5 Vdc Vdd (V) idd (mA) T Gate Bias Voltage (Vgg) -3 to 0 Vdc +5 1100 m rf input power (rfin) +18 dBm +5.5 1100 s Channel Temperature 175 °C +6 1100 Continuous pdiss (T = 85 °C) r - 11.7 w (derate 129 mw/°C above 85 °C) Adjust Vgg to achieve idd = 1100 mA e Thermal resistance w 7.7 °C/w (channel to ground paddle) o storage Temperature -65 to 150 °C eleCTrosTATiC sensiTiVe DeViCe p operating Temperature -40 to 85 °C oBserVe HAnDlinG preCAUTions esD sensitivity (HBm) Class 0, passed 150V r &
16-Terminal Ceramic Leadless Chip Carrier with Heat Sink [LCC_HS]
A
(EP-16-2) Outline Drawing Dimensions shown in millimeters.
e
3.45
lin
6.20 1.65 0.31 6.00 SQ 0.25 0.35
s -
5.80 PIN 1 0.19 INDICATOR 0.80 1.05
r
12 16 1.00 BSC
ie
11 1 3.46 2.06 3.40 2.00
lif
3.55 3.34 1.94 SQ
p
9 3
m
0.56 8 4 0.50
A
TOP VIEW BOTTOM VIEW 0.90 0.44 0.63 1.444 1.21 0.57 SIDE VIEW 1.317 1.15 0.51 1.190 1.09 4.70 4.65 FOR PROPER CONNECTION OF 0.44 BSC 0.50 MAX 4.60 THE EXPOSED PAD, REFER TO COPLANARITY THE PIN CONFIGURATION AND 0.08 FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. PKG-004903 05-19-2017-C
16-Terminal Ceramic leadless Chip Carrier with Heat sink [lCC_Hs] (ep-16-2) Dimensions shown in mil imeters.
Package Information
part number package Body material lead finish msl rating [2] package marking [1] H6981 HmC6981ls6 AlUminA wHiTe Gold over nickel n/A XXXX [1] 4-Digit lot number XXXX [2] max peak reflow temperature of 260 °C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
7
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Noise Figure vs. Frequency P1dB vs. Temperature Psat vs. Temperature P1dB vs. Vdd Psat vs. Vdd Power Compression @ 4 GHz Power Compression @ 10 GHz Power Compression @ 20 GHz Power Dissipation Second Harmonics vs. Temperature @ Pout = 18 dBm Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Pout Reverse Isolation vs Temperature Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit