Datasheet HMC6981LS6 (Analog Devices) - 3

FabricanteAnalog Devices
DescripciónGaAs pHEMT MMIC 2 WATT POWER AMPLIFIER, 15 - 20 GHz
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HMC6981LS6. GaAs pHEMT MMIC 2 WATT. POWER AMPLIFIER, 15 - 20 GHz. P1dB vs. Temperature. P1dB vs Supply Voltage

HMC6981LS6 GaAs pHEMT MMIC 2 WATT POWER AMPLIFIER, 15 - 20 GHz P1dB vs Temperature P1dB vs Supply Voltage

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HMC6981LS6
v03.1018
GaAs pHEMT MMIC 2 WATT POWER AMPLIFIER, 15 - 20 GHz P1dB vs. Temperature P1dB vs Supply Voltage
36 38 T 34 36 m s 34 ) 32 m 32 (dBm) r - (dB 30 30 e 1dB P +25 C P1dB 28 +85 C w -40 C 28 5V o 26 5.5V 26 6V p 24 24 15 16 17 18 19 20 15 16 17 18 19 20 FREQUENCY (GHz) r & FREQUENCY (GHz) A e
Psat vs. Temperature Psat vs. Supply Voltage
38 38 lin 36 36 s - 34 34 r ) m m 32 32 ie (dB (dB at at s 30 +25 C s 30 P +85 C P 5V lif -40 C 5.5V 28 28 p m 26 26 A 24 24 15 16 17 18 19 20 15 16 17 18 19 20 FREQUENCY (GHz) FREQUENCY (GHz)
P1dB vs. Supply Current Psat vs. Supply Current
34 38 32 36 30 34 ) m m 28 32 (dB (dB at 1dB 26 s 30 P P 800 mA 1100 mA 24 28 900 mA 1200 mA 800 mA 1100 mA 1000 mA 22 900 mA 1200 mA 26 1000 mA 20 24 15 16 17 18 19 20 15 16 17 18 19 20 FREQUENCY (GHz) FREQUENCY (GHz) For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Noise Figure vs. Frequency P1dB vs. Temperature Psat vs. Temperature P1dB vs. Vdd Psat vs. Vdd Power Compression @ 4 GHz Power Compression @ 10 GHz Power Compression @ 20 GHz Power Dissipation Second Harmonics vs. Temperature @ Pout = 18 dBm Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Pout Reverse Isolation vs Temperature Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit