Datasheet HMC1087F10 (Analog Devices) - 6

FabricanteAnalog Devices
Descripción8 WATT Flange Mount GaN MMIC POWER AMPLIFIER, 2 - 20 GHz
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HMC1087F10. 8 WATT Flange Mount GaN MMIC. POWER AMPLIFIER, 2 - 20 GHz. Reverse Isolation vs. Temperature

HMC1087F10 8 WATT Flange Mount GaN MMIC POWER AMPLIFIER, 2 - 20 GHz Reverse Isolation vs Temperature

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HMC1087F10
v04.1217
8 WATT Flange Mount GaN MMIC POWER AMPLIFIER, 2 - 20 GHz Reverse Isolation vs. Temperature Second Harmonics vs. Temperature [1]
0 80 70 -10 T 60 ) (dBc) C (dB 50 m -20 N IO s T 40 LA HARMONI -30 O 30 IS 20 r - -40 SECOND 10 e -50 0 w 2 5 8 11 14 17 20 2 5 8 11 14 17 20 FREQUENCY (GHz) o FREQUENCY(GHz) p +25 C +85 C -40 C +25 C +85 C -40 C r & A
Second Harmonics vs. Supply Voltage [1] Second Harmonics vs. Pin
e 80 80 70 70 lin 60 (dBc) 60 (dBc) C C 50 50 s - 40 40 HARMONI HARMONI r 30 30 20 20 ie SECOND SECOND 10 10 lif 0 0 2 5 8 11 14 17 20 2 5 8 11 14 17 20 p FREQUENCY(GHz) FREQUENCY(GHz) m 24V 28V 32V +6 dBm +24 dBm +12 dBm +30 dBm A +18 dBm
Power Dissipation
30 (W) 25 20 DISSIPATION 15 POWER 10 2 6 10 14 18 22 26 30 34 INPUT POWER (dBm) 2 GHz 11 GHz 20 GHz 6 GHz 16 GHz [1] second Harmonic data pin=12 dBm. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Low Frequency Gain & Return Loss Noise Figure vs. Frequency P1dB vs. Temperature Psat vs. Temperature P1dB vs. Vdd Psat vs. Vdd Output IP3 vs. Temperature @ Pout = 18 dBm Tone Power Compression @ 10 GHz Power Dissipation Second Harmonics vs. Temperature @ Pout = 18 dBm Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Pout Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit