Datasheet HMC952ALP5GE (Analog Devices) - 6

HMC952ALP5GE
v03.0418
GaAs pHEMT MMIC 2 Watt POWER AMPLIFIER WITH POWER DETECTOR 8 - 14 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +6.5 Vdc Vdd (V) idd (mA) Gate Bias Voltage (Vgg) -3 - 0 Vdc +5 1400 T rf input power (rfin) 24 dBm +6 1400 m Channel Temperature 175 °C s Continuous pdiss (T= 85 °C) Adjust Vgg1 = Vgg2 = Vgg3 to achieve idd = 1400 mA 10 w (derate 137 mw/°C above 85 °C) Thermal resistance r - 9 °C/w (channel to die bottom) e storage Temperature -65 to 150°C eleCTrosTATiC sensiTiVe DeViCe w operating Temperature -55 to 85 °C oBserVe HAnDlinG preCAUTions o esD sensitivity (HBm) Class 0 p
24-Lead Lead Frame Chip Scale Package [LFCSP] 5 x 5 mm Body and 0.90 mm Package Height (CP-24-20) Outline Drawing Dimensions shown in millimeters
r & A
5.10 0.35
e
5.00 SQ 0.30 PIN 1 4.90 0.25 PIN 1 INDICATOR INDICATOR 19 24
lin
18 1 0.65 BSC 3.25
s -
EXPOSED 3.10 SQ PAD 2.95
r
13 6
ie
0.45 12 7 TOP VIEW 0.20 MIN 0.40 BOTTOM VIEW 3.25 REF
lif
0.35 1.00 FOR PROPER CONNECTION OF
p
0.90 THE EXPOSED PAD, REFER TO SIDE VIEW THE PIN CONFIGURATION AND
m
0.80 0.05 MAX 0.02 NOM FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
A
COPLANARITY SEATING 0.08 PLANE 0.203 REF PKG-000000 COMPLIANT TO JEDEC STANDARDS MO-220-VHHC-1. 03-04-2016-A
24-lead lead frame Chip scale package [lfCsp] 5 mm × 5 mm Body and 0.90 mm package Height (Cp-24-20) Dimensions shown in mil imeters.
Package Information
part number package Body material lead finish msl rating [2] package marking [1] H952A HmC952Alp5Ge roHs-compliant low stress injection molded plastic 100% matte sn msl3 XXXX [1] 4-Digit lot number XXXX [2] max peak reflow temperature of 260 °C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Low Frequency Gain & Return Loss Noise Figure vs. Frequency P1dB vs. Temperature Psat vs. Temperature P1dB vs. Vdd Psat vs. Vdd Output IP3 vs. Temperature @ Pout = 18 dBm Tone Output IP3 vs. Vdd @ Pout = 18 dBm Tone Power Compression @ 4 GHz Power Compression @ 10 GHz Power Compression @ 20 GHz Power Dissipation Second Harmonics vs. Temperature @ Pout = 18 dBm Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Pout Reverse Isolation vs Temperature Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit