HMC994APM5E v04.0218 GaAs pHEMT MMICPOWER AMPLIFIER, DC - 28 GHzAbsolute Maximum RatingsReliability Information Drain Bias Voltage (Vdd) +12 Vdc Channel Temperature to maintain 175 °C 1 million Hour mTTf Gate Bias Voltage (Vgg1) -3 to 0 Vdc Thermal resistance T Gate Bias Voltage (Vgg2) 2.5V min up to (Vdd - 5.5V) 25.7 °C/w (channel to ground paddle) m rf input power (rfin) +25 dBm s Continuous pdiss (T= 85 °C) 3.5 w (derate 38.9 mw/°C above 85 °C) r - output load Vswr 7:1 e storage Temperature -65 to 150°C eleCTrosTATiC sensiTiVe DeViCe w oBserVe HAnDlinG preCAUTions operating Temperature -40 to 85 °C o esD sensitivity (HBm) Class 0B, passed 150V. Stresses at or above those listed under Absolute Maxi- p mum Ratings may cause permanent damage to the prod- uct. This is a stress rating only, functional operation of the product at these or any other conditions above those indi- cated in the operational section of this specification is not r & implied. Operation beyond the maximum operating condi- A tions for extended per32-Lead Lead Frame Chip Scale Package, Premolded Cavity [LFCSP_CA ioV] ds may affect product reliability.5 x 5 mm Body and 1.25 mm Package Height e (CG-32-2)Dimensions shown in millimetersOutline Drawing lin DETAIL A(JEDEC 95)5.100.305.00 SQ0.25 s - PIN 14.900.20INDICATORPIN 1INDICATOR AREA OPTIONS r 2532(SEE DETAIL A)241 ie 0.50BSC3.20EXPOSED3.10 SQPAD lif 3.00 p 178 m 1690.45TOP VIEWBOTTOM VIEW0.40 A 3.50 REF0.351.350.60 REF SIDE VIEW1.250.401.150.050 MAX0.035 NOMCOPLANARITYSEATING0.08PLANE0.203 REFPKG-00506808-30-2016-A 32-lead lead frame Chip scale package, premolded Cavity [lfCsp_CAV] 5 mm × 5 mm and 1.25 mm package Height (CG-32-2) Package Information part number package Body material lead finish msl rating [1] package marking HmC994Apm5e roHs-compliant low stress pre-molded plastic nipdAu msl3 HmC994A [1] max peak reflow temperature of 260 °C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D 10 Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Noise Figure vs. Frequency P1dB vs. Temperature Psat vs. Temperature P1dB vs. Vdd Psat vs. Vdd Output IP3 vs. Temperature @ Pout = 18 dBm Tone Power Compression @ 10 GHz Power Dissipation Second Harmonics vs. Temperature @ Pout = 18 dBm Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Pout Reverse Isolation vs Temperature Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit