GaAs, pHEMT, MMIC,1/2 W, 20 GHz to 44 GHz, Power Amplifier
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23 /10 — ADPA7002CHIP. Data Sheet. ) 14. 4.0V. E (%. +85°C. 5.0V. +25°C. PA 10. …
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C
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PDF / 532 Kb
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ADPA7002CHIP. Data Sheet. ) 14. 4.0V. E (%. +85°C. 5.0V. +25°C. PA 10. –55°C. FREQUENCY (GHz). 1020. POUT GAIN. 960. PAE. IDD. 900. , P B). 840. N (. mA). 700mA
ADPA7002CHIPData Sheet24242222202018181616)14) 144.0VE (%1212E (%+85°C5.0VPA10+25°CPA 10–55°C886644220020222426283032343638404244 028 05101520253035404550 031 FREQUENCY (GHz)FREQUENCY (GHz) 17236- 17236- Figure 28. Power Added Efficiency (PAE) vs. Frequency over Temperature, Figure 31. PAE vs. Frequency for Various Drain Voltages, PAE Measured at PSAT PAE Measured at PSAT 2435102022POUT GAIN3096020PAE%)IDD18(25900AE16, P B))14d20840N (mA)E (%12700mAAI(600mAPA, G15780I DD10800mABm)8d (107206UT OP45660206000–4–2024681012141618 032 20222426283032343638404244 029 INPUT POWER (dBm) 17236- FREQUENCY (GHz) 17236- Figure 29. PAE vs. Frequency for Various Quiescent Drain Currents, Figure 32. POUT, Gain, PAE, and IDD vs. Input Power, Frequency = 22 GHz PAE Measured at PSAT 351230351230POUTPOUT30GAIN114030GAIN1140PAEPAE%)I%)(DDI(DD251050AE251050AE, P, PB)B)d20960d20960N (mA)N (mA)AI(AI(, G15870I DD, G15870I DDBm)Bm)dd(10780(10780UTUTOOPP5690569006000600–5–3–11357911131517 030 –5–3–11357911131517 033 INPUT POWER (dBm) 17236- INPUT POWER (dBm) 17236- Figure 30. POUT, Gain, PAE, and IDD vs. Input Power, Frequency = 26 GHz Figure 33. POUT, Gain, PAE, and IDD vs. Input Power, Frequency = 30 GHz Rev. C | Page 10 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 34 GHz FREQUENCY RANGE 34 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS CONSTANT DRAIN CURRENT (IDD) OPERATION THEORY OF OPERATION ADPA7002CHIP ASSEMBLY AND CIRCUIT DIAGRAMS ALTERNATE ASSEMBLY DIAGRAM BIASING PROCEDURES BIASING THE ADPA7002CHIP WITH THE HMC980LP4E Application Circuit Setup Limiting VGATE to Meet ADPA7002CHIP VGGx AMR Requirement HMC980LP4E Bias Sequence Constant Drain Current Bias vs. Constant Gate Voltage Bias MOUNTING AND BONDING TECHNIQUES FOR MILLIMETER WAVE GAAS MMICS Handling Precautions Mounting Wire Bonding OUTLINE DIMENSIONS ORDERING GUIDE