Datasheet ADPA7005CHIP (Analog Devices)
Fabricante | Analog Devices |
Descripción | GaAs, pHEMT, MMIC,1 W Power Amplifier, 20 GHz to 44 GHz |
Páginas / Página | 23 / 1 — GaAs, pHEMT, MMIC,1 W Power Amplifier,. 20 GHz to 44 GHz. Data Sheet. … |
Formato / tamaño de archivo | PDF / 522 Kb |
Idioma del documento | Inglés |
GaAs, pHEMT, MMIC,1 W Power Amplifier,. 20 GHz to 44 GHz. Data Sheet. ADPA7005CHIP. FEATURES. FUNCTIONAL BLOCK DIAGRAM
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GaAs, pHEMT, MMIC,1 W Power Amplifier, 20 GHz to 44 GHz Data Sheet ADPA7005CHIP FEATURES FUNCTIONAL BLOCK DIAGRAM Output P1dB: 31 dBm typical at 20 GHz to 34 GHz VGG1 VDD5 V V DD3 DD1 VREF PSAT: 32 dBm typical at 20 GHz to 34 GHz Gain: 17 dB typical at 20 GHz to 34 GHz Output IP3: 41 dBm typical at 20 GHz to 34 GHz Supply voltage: 5 V at 1200 mA maximum 50 Ω matched input/output Die size: 3.75 mm × 3.47 mm × 0.1 mm RFIN RFOUT APPLICATIONS Military and space Test instrumentation VDET
001
V V V V GG2 DD6 DD4 DD2
17319- Figure 1.
GENERAL DESCRIPTION
The ADPA7005CHIP is a gallium arsenide (GaAs), order intercept (IP3) of 41 dBm. The ADPA7005CHIP requires pseudomorphic high electron mobility transistor (pHEMT), 1200 mA from a 5 V supply on the supply voltage (VDD) and monolithic microwave integrated circuit (MMIC), distributed features inputs and outputs that are internal y matched to 50 Ω, power amplifier that operates from 20 GHz to 44 GHz. The facilitating integration into multichip modules (MCMs). All amplifier provides 17 dB of small signal gain, 31 dBm output data is taken with the chip connected via two 0.025 mm wire power for 1 dB compression (P1dB), and a typical output third- bonds that are at least 0.31 mm long.
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Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 34 GHz FREQUENCY RANGE 34 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTIC CONSTANT IDD OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding BIASING ADPA7005CHIP WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE FOR ADPA7005CHIP VGGx ABSOLUTE MAXIMUM RATING REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE