Datasheet ADPA7004CHIPS (Analog Devices) - 5
| Fabricante | Analog Devices |
| Descripción | 40 GHz to 80 GHz, GaAs, pHEMT, MMIC, Wideband Power Amplifier |
| Páginas / Página | 20 / 5 — Data Sheet. ADPA7004CHIPS. ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL … |
| Formato / tamaño de archivo | PDF / 465 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADPA7004CHIPS. ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE. Parameter. Rating. Table 5. Package Type. Unit
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Data Sheet ADPA7004CHIPS ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to system design and VDD 4.5 V operating environment. Careful attention to printed circuit VGG −2 V dc to 0 V dc board (PCB) thermal design is required. RF Input Power (RFIN) 18 dBm θ Continuous Power Dissipation (P JC is the channel to case thermal resistance, channel to bottom DISS), 3.04 W at T of die attach epoxy. DIE BOTTOM = 85°C (Derate 33.3 mW/°C Above 85°C)
Table 5.
Temperature
Package Type θ
Storage Range (Ambient) −65°C to +150°C
JC Unit
C-16-4 29.6 °C/W Operating Range (Die Bottom) −55°C to +85°C Junction Temperature to Maintain 175 1,000,000 Hours Mean Time to Failure (MTTF)
ELECTROSTATIC DISCHARGE (ESD) RATINGS
Nominal Junction Temperature (TJ = 85°C, 142 The fol owing ESD information is provided for handling of VDD = 3.5 V, IDQ = 550 mA) ESD-sensitive devices in an ESD protected area only. Stresses at or above those listed under Absolute Maximum Human body model (HBM) per ANSI/ESDA/JEDDEC JS-001. Ratings may cause permanent damage to the product. This is a
ESD Ratings ADPA7004CHIPS
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
Table 6. ADPA7004CHIPS, 16-Pad CHIP
section of this specification is not implied. Operation beyond
ESD Model Withstand Threshold (V) Class
the maximum operating conditions for extended periods may HBM ±125 0 affect product reliability.
ESD CAUTION
Rev. 0 | Page 5 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 40 GHz TO 45 GHz FREQUENCY RANGE 45 GHz TO 75 GHz FREQUENCY RANGE 75 GHz TO 80 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ELECTROSTATIC DISCHARGE (ESD) RATINGS ESD Ratings ADPA7004CHIPS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION POWER-UP AND POWER-DOWN SEQUENCING Power-Up Sequence Power-Down Sequence RF DETECTOR OPERATION ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding OUTLINE DIMENSIONS ORDERING GUIDE
Thermal performance is directly linked to system design and VDD 4.5 V operating environment. Careful attention to printed circuit VGG −2 V dc to 0 V dc board (PCB) thermal design is required. RF Input Power (RFIN) 18 dBm θ Continuous Power Dissipation (P JC is the channel to case thermal resistance, channel to bottom DISS), 3.04 W at T of die attach epoxy. DIE BOTTOM = 85°C (Derate 33.3 mW/°C Above 85°C)
Table 5.
Temperature
Package Type θ
Storage Range (Ambient) −65°C to +150°C
JC Unit
C-16-4 29.6 °C/W Operating Range (Die Bottom) −55°C to +85°C Junction Temperature to Maintain 175 1,000,000 Hours Mean Time to Failure (MTTF)
ELECTROSTATIC DISCHARGE (ESD) RATINGS
Nominal Junction Temperature (TJ = 85°C, 142 The fol owing ESD information is provided for handling of VDD = 3.5 V, IDQ = 550 mA) ESD-sensitive devices in an ESD protected area only. Stresses at or above those listed under Absolute Maximum Human body model (HBM) per ANSI/ESDA/JEDDEC JS-001. Ratings may cause permanent damage to the product. This is a
ESD Ratings ADPA7004CHIPS
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
Table 6. ADPA7004CHIPS, 16-Pad CHIP
section of this specification is not implied. Operation beyond
ESD Model Withstand Threshold (V) Class
the maximum operating conditions for extended periods may HBM ±125 0 affect product reliability.
ESD CAUTION
Rev. 0 | Page 5 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 40 GHz TO 45 GHz FREQUENCY RANGE 45 GHz TO 75 GHz FREQUENCY RANGE 75 GHz TO 80 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ELECTROSTATIC DISCHARGE (ESD) RATINGS ESD Ratings ADPA7004CHIPS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION POWER-UP AND POWER-DOWN SEQUENCING Power-Up Sequence Power-Down Sequence RF DETECTOR OPERATION ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding OUTLINE DIMENSIONS ORDERING GUIDE