Datasheet HMC606LC5 (Analog Devices) - 8

FabricanteAnalog Devices
DescripciónGaAs, InGaP, HBT, MMIC, Ultralow Phase Noise, Distributed Amplifier, 2 GHz to 18 GHz
Páginas / Página9 / 8 — HMC606LC5. Data Sheet. APPLICATIONS INFORMATION EVALUATION PRINTED …
RevisiónJ
Formato / tamaño de archivoPDF / 204 Kb
Idioma del documentoInglés

HMC606LC5. Data Sheet. APPLICATIONS INFORMATION EVALUATION PRINTED CIRCUIT BOARD (PCB)

HMC606LC5 Data Sheet APPLICATIONS INFORMATION EVALUATION PRINTED CIRCUIT BOARD (PCB)

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HMC606LC5 Data Sheet APPLICATIONS INFORMATION EVALUATION PRINTED CIRCUIT BOARD (PCB)
Use a sufficient number of via holes to connect the top and bottom The circuit board used in the application must use RF circuit ground planes. Mount the evaluation PCB to an appropriate design techniques. Signal lines must have 50 Ω impedance, and heat sink. The evaluation PCB shown in Figure 17 is available the package ground leads and package bottom must be connected from Analog Devices, Inc., upon request. directly to the ground plane similar to that shown in Figure 17. 018 14968- Figure 17. Evaluation PCB
Table 6. List of Materials for Evaluation PCB (117156-HMC606LC51 ) Item Description
J1, J2 SRI K connectors J3, J4 2 mm Molex headers C1, C2 4.7 μF, tantalum capacitors C3, C4 100 pF capacitors, 0402 package C5, C6 1000 pF capacitors, 0603 package U1 HMC606LC5 PCB 117325-1 evaluation PCB; circuit board material: Rogers 4350 1 Reference this number when ordering the complete evaluation PCB. Rev. J | Page 8 of 9 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION EVALUATION PRINTED CIRCUIT BOARD (PCB) OUTLINE DIMENSIONS ORDERING GUIDE