HMC504LC4B v05.0918 GaAs HEMT MMIC LOW NOISEAMPLIFIER, 14 - 27 GHzAbsolute Maximum Ratings Drain Bias Voltage +4.5V RF Input Power +6 dBm ELECTROSTATIC SENSITIVE DEVICE T Gate Bias Voltage -2 to 0.3V OBSERVE HANDLING PRECAUTIONS M Channel Temperature 180 °C Continuous Pdiss (T = 85 °C) 1.9 W (derate 20 mW/°C above 85 °C) Thermal Resistance E - S 50 °C/W (Channel to ground paddle) IS Storage Temperature -65 to +150 °C O Operating Temperature -40 to +85 °C ESD Sensitivity (HBM) Class 1A 24-Terminal Ceramic Leadless Chip Carrier [LCC] W N (E-24-2)Dimensions shown in millimeters. O Outline Drawing S - L 4.050.36 R 3.90 SQ0.30PIN 13.750.080.24 IE INDICATORBSCPIN 11924181 LIF 0.50 P BSC2.60EXPOSEDPAD2.50 SQ M 2.40 A 136127TOP VIEW0.32BOTTOM VIEWBSC2.50 REF1.203.10 BSC1.10SIDE VIEW1.00FOR PROPER CONNECTION OFTHE EXPOSED PAD, REFER TOTHE PIN CONFIGURATION ANDSEATINGFUNCTION DESCRIPTIONSPLANESECTION OF THIS DATA SHEET.PKG-00484102-27-2017-A 24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-2) Dimensions shown in mil imeters Package Information Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC504LC4B Alumina, White Gold over Nickel MSL3 [1] H504 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D 4 Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Gain, Noise Figure & Power vs. Supply Voltage @ 21 GHz Power Compression @ 21 GHz Reverse Isolation vs. Temperature Psat vs. Temperature P1dB vs. Temperature Output IP3 vs. Temperature Noise Figure vs. Temperature Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Temperature Broadband Gain & Return Loss Absolute Maximum Ratings Outline Drawing Pin Descriptions Application Circuit Evaluation PCB List of Materials