Datasheet HMC902 (Analog Devices) - 9

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Data Sheet HMC902 APPLICATIONS INFORMATION
The HMC902 has VGG1 and VGG2 optional gate bias pads. When The recommended bias sequence during power-down is as these pads are left open, the amplifier runs in self biased operation follows: with typical IDQ = 80 mA. Figure 25 shows the basic connections 1. Turn off the RF signal. for operating the HMC902 in self biased operation mode. Both 2. Decrease VGG1 to −0.8 V to achieve typical IDQ = 0 mA. the RFIN and the RFOUT ports of the HMC902 have on-chip 3. Decrease VDD1 and VDD2 to 0 V. dc block capacitors, which eliminates the need for external 4. Increase VGG1 to 0 V. ac coupling capacitors. The bias conditions previously listed (V When using the V DD1 and VDD2 = 3.5 V and GG1 and the VGG2 gate bias pads, follow bias I sequencing to prevent damage to the amplifier. DQ = 80 mA) are the recommended operating points to achieve optimum performance. The data used in this data sheet is taken The recommended bias sequence during power-up is as follows: with the recommended bias conditions listed in the Electrical 1. Connect to GND. Specifications section. If the HMC902 is used with different bias 2. Set V conditions than what is recommended, a different performance GG1 to −0.8 V. 3. Set V than what is shown in the Typical Performance Characteristics DD1 and VDD2 to 3.5 V. 4. Increase V section can result. Decreasing the V GG1 to achieve typical IDQ = 80 mA. DD level has a negligible 5. Apply the RF signal. effect on gain and NF performance, but reduces P1dB. This behavior is seen in Figure 18. For applications where the P1dB requirement is not stringent, the HMC902 can be down biased to reduce power consumption. Rev. D | Page 9 of 13 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUITS ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE