Datasheet HMC1040CHIPS (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | 20 GHz to 44 GHz, GaAs, pHEMT, MMIC, Low Noise Amplifier |
| Páginas / Página | 14 / 6 — HMC1040CHIPS. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. … |
| Formato / tamaño de archivo | PDF / 351 Kb |
| Idioma del documento | Inglés |
HMC1040CHIPS. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. VDD1. VDD2. VDD3. RFIN. RFOUT 5
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HMC1040CHIPS Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS HMC1040CHIPS 2 3 4 VDD1 VDD2 VDD3 1 RFIN RFOUT 5
002 16709- Figure 2. Pad Configuration
Table 7. Pad Function Descriptions Pad No. Mnemonic Description
1 RFIN Radio Frequency Input. This pad ac couples the RF signal, has a 5 kΩ resistor connected to GND, and is matched to 50 Ω. See Figure 3 for the interface schematic. 2, 3, 4 VDD1, VDD2, VDD3 Power Supply Voltages for the Amplifier. Connect a dc bias to provide drain current (IDD). See Figure 4 for the interface schematic. 5 RFOUT RF Output. This pad ac couples the RF signal, has a 5 kΩ resistor connected to GND, and is matched to 50 Ω. See Figure 5 for the interface schematic. Die Bottom GND Ground. Die bottom must be connected to RF/dc ground. See Figure 6 for the interface schematic.
INTERFACE SCHEMATICS RFOUT RFIN 5kΩ
005
5kΩ
003 16709- 16709- Figure 3. RFIN Interface Schematic Figure 5. RFOUT Interface Schematic
VDD1, VDD2, VDD3 GND
006 004 16709- 16709- Figure 4. VDD1, VDD2, VDD3, Interface Schematic Figure 6. GND Interface Schematic Rev. 0 | Page 6 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 24 GHz FREQUENCY RANGE 24 GHz TO 32 GHz FREQUENCY RANGE 32 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
HMC1040CHIPS Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS HMC1040CHIPS 2 3 4 VDD1 VDD2 VDD3 1 RFIN RFOUT 5
002 16709- Figure 2. Pad Configuration
Table 7. Pad Function Descriptions Pad No. Mnemonic Description
1 RFIN Radio Frequency Input. This pad ac couples the RF signal, has a 5 kΩ resistor connected to GND, and is matched to 50 Ω. See Figure 3 for the interface schematic. 2, 3, 4 VDD1, VDD2, VDD3 Power Supply Voltages for the Amplifier. Connect a dc bias to provide drain current (IDD). See Figure 4 for the interface schematic. 5 RFOUT RF Output. This pad ac couples the RF signal, has a 5 kΩ resistor connected to GND, and is matched to 50 Ω. See Figure 5 for the interface schematic. Die Bottom GND Ground. Die bottom must be connected to RF/dc ground. See Figure 6 for the interface schematic.
INTERFACE SCHEMATICS RFOUT RFIN 5kΩ
005
5kΩ
003 16709- 16709- Figure 3. RFIN Interface Schematic Figure 5. RFOUT Interface Schematic
VDD1, VDD2, VDD3 GND
006 004 16709- 16709- Figure 4. VDD1, VDD2, VDD3, Interface Schematic Figure 6. GND Interface Schematic Rev. 0 | Page 6 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 24 GHz FREQUENCY RANGE 24 GHz TO 32 GHz FREQUENCY RANGE 32 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE