Data SheetADL5721PIN CONFIGURATION AND FUNCTION DESCRIPTIONSVCC1 18 VCC2GND 27 OUTNADL5721INPT 3TOP VIEW6 OUTP(Not to Scale)RBIAS 45 BANDNOTES 1. THE EXPOSED PAD MUST BE SOLDERED TO A LOW IMPEDANCE GROUND PLANE. 2. THE DEVICE NUMBER ON THE FIGURE DOES NOT INDICATE THE LABEL ON 002 THE PACKAGE. REFER TO THE PIN 1 INDICATOR FOR THE PIN LOCATIONS. 14258- Figure 2. Pin Configuration Table 5. Pin Function Descriptions Pin No.MnemonicDescription 1 VCC1 1.8 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible. 2 GND Ground. 3 INPT RF Input. This pin is a 50 Ω single-ended input. 4 RBIAS Resistor Bias. For typical operation, connect a 442 Ω resistor from RBIAS to GND. It is recommended to place the RBIAS resistor as close to the pin as possible. 5 BAND Band Select Control. Select a logic low of 0 V for the lower frequency range from 5.9 GHz to 7.2 GHz. Select a logic high of 1.8 V for the higher frequency range from 7.1 GHz to 8.5 GHz. 6, 7 OUTP, OUTN RF Outputs. These pins are 100 Ω differential outputs. 8 VCC2 3.3 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible. EPAD (EP) Exposed Pad. The exposed pad must be soldered to a low impedance ground plane. Rev. 0 | Page 5 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS AC SPECIFICATIONS DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS LOW BAND (BAND = 0 V) HIGH BAND (BAND = 1.8 V) THEORY OF OPERATION APPLICATIONS INFORMATION LAYOUT DIFFERENTIAL vs. SINGLE-ENDED OUTPUT EVALUATION BOARD INITIAL SETUP RESULTS BASIC CONNECTIONS FOR OPERATION OUTLINE DIMENSIONS ORDERING GUIDE