Datasheet HMC8400 (Analog Devices) - 8
| Fabricante | Analog Devices |
| Descripción | 2 GHz to 30 GHz, GaAs pHEMT MMIC Low Noise Amplifier |
| Páginas / Página | 15 / 8 — HMC8400. Data Sheet. +85°C. +25°C. –55°C. Bm). B (. FREQUENCY (GHz). 4V … |
| Revisión | B |
| Formato / tamaño de archivo | PDF / 313 Kb |
| Idioma del documento | Inglés |
HMC8400. Data Sheet. +85°C. +25°C. –55°C. Bm). B (. FREQUENCY (GHz). 4V 5V. +25°C –55°C. 3 (. 4GHz. 10GHz 16GHz. 22GHz 28GHz. Bc). D3 (. OUT/TONE (dBm)
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HMC8400 Data Sheet 21 18 4V 20 +85°C 17 5V +25°C 6V 19 –55°C 16 18 15 17 14 Bm) 16 Bm) d d ( 13 B ( AT 15 S 1d P P 12 14 11 13 12 10 11 9 10 8 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
012
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
013
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 14. PSAT vs. Frequency at Various Temperatures Figure 17. P1dB vs. Frequency at Various Supply Voltages
21 30 20 4V 5V +85°C 19 6V 28 +25°C –55°C 18 26 17 Bm) 16 d Bm) ( d 24 AT 15 3 ( S IP P 14 22 13 12 20 11 10 18 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
014
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
015
FREQUENCY (GHz) FREQUENCY (GHz)
13852- 13852- Figure 15. PSAT vs. Frequency at Various Supply Voltages Figure 18. Output IP3 vs. Frequency for Various Temperatures at POUT = 0 dBm/Tone
30 60 4V 5V 4GHz 28 6V 10GHz 16GHz 50 22GHz 28GHz 26 Bc) Bm) d d 24 40 3 ( D3 ( IP IM 22 30 20 18 20 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
016
0 1 2 3 4 5 6 7 8
017
FREQUENCY (GHz) P
13852-
OUT/TONE (dBm)
13852- Figure 16. Output IP3 vs. Frequency at Various Supply Voltages Figure 19. Output Third-Order Intermodulation (IMD3) vs. POUT/Tone for Various Frequencies at VDD = 4 V Rev. B | Page 8 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
012
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
013
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 14. PSAT vs. Frequency at Various Temperatures Figure 17. P1dB vs. Frequency at Various Supply Voltages
21 30 20 4V 5V +85°C 19 6V 28 +25°C –55°C 18 26 17 Bm) 16 d Bm) ( d 24 AT 15 3 ( S IP P 14 22 13 12 20 11 10 18 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
014
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
015
FREQUENCY (GHz) FREQUENCY (GHz)
13852- 13852- Figure 15. PSAT vs. Frequency at Various Supply Voltages Figure 18. Output IP3 vs. Frequency for Various Temperatures at POUT = 0 dBm/Tone
30 60 4V 5V 4GHz 28 6V 10GHz 16GHz 50 22GHz 28GHz 26 Bc) Bm) d d 24 40 3 ( D3 ( IP IM 22 30 20 18 20 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
016
0 1 2 3 4 5 6 7 8
017
FREQUENCY (GHz) P
13852-
OUT/TONE (dBm)
13852- Figure 16. Output IP3 vs. Frequency at Various Supply Voltages Figure 19. Output Third-Order Intermodulation (IMD3) vs. POUT/Tone for Various Frequencies at VDD = 4 V Rev. B | Page 8 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE