Datasheet HMC8400 (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | 2 GHz to 30 GHz, GaAs pHEMT MMIC Low Noise Amplifier |
| Páginas / Página | 15 / 6 — HMC8400. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. VDD. … |
| Revisión | B |
| Formato / tamaño de archivo | PDF / 313 Kb |
| Idioma del documento | Inglés |
HMC8400. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. VDD. RFOUT. 2 VGG2. RFIN
Línea de modelo para esta hoja de datos
Versión de texto del documento
link to page 6 link to page 6 link to page 6 link to page 6 link to page 6
HMC8400 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 3 VDD HMC8400 RFOUT 4 2 VGG2 1 RFIN
031
NOTES 1. DIE BOTTOM MUST BE CONNECTED TO RF/DC GROUND.
13852- Figure 2. Pad Configuration
Table 5. Pad Function Descriptions Pad No. Mnemonic Description
1 RFIN Radio Frequency (RF) Input. This pad is ac-coupled, but has a large resistor to GND for ESD protection, and matched to 50 Ω. See Figure 3 for the interface schematic. 2 VGG2 Gain Control. This pad is dc-coupled and accomplishes gain control by bringing this voltage lower and becoming more negative. See Figure 4 for the interface schematic. 3 VDD Power Supply Voltage for the Amplifier. Connect a dc bias to provide drain current (IDD). See Figure 5 for the interface schematic. 4 RFOUT RF Output. This pad is ac-coupled, but has a large resistor to GND for ESD protection, and matched to 50 Ω. See Figure 6 for the interface schematic. Die Bottom GND Die bottom must be connected to RF/dc ground. See Figure 7 for the interface schematic.
INTERFACE SCHEMATICS RFIN RFOUT
002 004 13852- 13852- Figure 3. RFIN Interface Schematic Figure 6. RFOUT Interface Schematic
VGG2 GND
030 005 13852- 13852- Figure 4. VGG2 Interface Schematic Figure 7. GND Interface Schematic
VDD
003 13852- Figure 5. VDD Interface Schematic Rev. B | Page 6 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
HMC8400 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 3 VDD HMC8400 RFOUT 4 2 VGG2 1 RFIN
031
NOTES 1. DIE BOTTOM MUST BE CONNECTED TO RF/DC GROUND.
13852- Figure 2. Pad Configuration
Table 5. Pad Function Descriptions Pad No. Mnemonic Description
1 RFIN Radio Frequency (RF) Input. This pad is ac-coupled, but has a large resistor to GND for ESD protection, and matched to 50 Ω. See Figure 3 for the interface schematic. 2 VGG2 Gain Control. This pad is dc-coupled and accomplishes gain control by bringing this voltage lower and becoming more negative. See Figure 4 for the interface schematic. 3 VDD Power Supply Voltage for the Amplifier. Connect a dc bias to provide drain current (IDD). See Figure 5 for the interface schematic. 4 RFOUT RF Output. This pad is ac-coupled, but has a large resistor to GND for ESD protection, and matched to 50 Ω. See Figure 6 for the interface schematic. Die Bottom GND Die bottom must be connected to RF/dc ground. See Figure 7 for the interface schematic.
INTERFACE SCHEMATICS RFIN RFOUT
002 004 13852- 13852- Figure 3. RFIN Interface Schematic Figure 6. RFOUT Interface Schematic
VGG2 GND
030 005 13852- 13852- Figure 4. VGG2 Interface Schematic Figure 7. GND Interface Schematic
VDD
003 13852- Figure 5. VDD Interface Schematic Rev. B | Page 6 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE