Data SheetHMC84012222+85°C+85°C+25°C+25°C20–55°C20–55°C1818Bm)1616Bm)dd((BAT1d14S14PP1212101088051015202530 016 051015202530 019 FREQUENCY (GHz) 13850- FREQUENCY (GHz) 13850- Figure 16. P1dB vs. Frequency at Various Temperatures Figure 19. PSAT vs. Frequency at Various Temperatures 22226.5V 7.5V208.5V201818Bm)1616dBm)(dB(1d14AT14PSP121210106.5V 7.5V 8.5V88051015202530 017 051015202530 020 FREQUENCY (GHz) 13850- FREQUENCY (GHz) 13850- Figure 17. P1dB vs. Frequency at Various Supply Voltages Figure 20. PSAT vs. Frequency at Various Supply Voltages 3055+85°C +25°C –55°C502645Bm)Bc)dd40(22(IP3IM3353GHz 7GHz1811GHz 17GHz3021GHz 25GHz 27GHz1425051015202530 018 012345678 021 FREQUENCY (GHz)P 13850- OUT/TONE (dBm) 13850- Figure 18. Output IP3 vs. Frequency for Various Temperatures at Figure 21. Output Third Order Intermodulation (IM3) vs. POUT/Tone for POUT = 0 dBm/Tone Various Frequencies at VDD = 6.5 V Rev. B | Page 9 of 17 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications 0.01 GHz to 3 GHz Frequency Range 3 GHz to 26 GHz Frequency Range 26 GHz to 28 GHz Frequency Range Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Typical Application Circuit Assembly Diagram Outline Dimensions Ordering Guide