Datasheet HMC8325 (Analog Devices) - 5

Data Sheet HMC8325 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS GND VG1 GND VD1 GND V GND V G2 D2 GND V GND V G3 D3 GND V GND V G4 D4 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 HMC8325 GND 3 20 GND RF 2 21 RF IN OUT GND 1 22 GND
002 14692- Figure 2. Pin Configuration
Table 4. Pin Function Descriptions Pad No. Mnemonic Description
1, 3, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22 GND Ground Connection. 2 RF RF Input. AC couple RF and match it to 50 Ω. IN IN 5, 9, 13, 17 V to V Gate Bias Voltage for the Low Noise Amplifier. G1 G4 7, 11, 15, 19 V to V Drain Bias Voltage for the Low Noise Amplifier. D1 D4 21 RF RF Output. AC couple RF and match it to 50 Ω. OUT OUT Die Bottom GND Ground. Die bottom must be connected to the RF/dc ground.
INTERFACE SCHEMATICS GND VD1, VD2, VD3, VD4
003 14692- 006 14692- Figure 3. GND Interface Schematic Figure 6. VD1 to VD4 Interface Schematic 004 007
RFIN RF
14692-
OUT
14692- Figure 4. RF Figure 7. RF IN Interface Schematic OUT Interface Schematic 005
VG1, VG2, VG3, VG4
14692- Figure 5. VG1 to VG4 Interface Schematic Rev. 0 | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATION INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE