Datasheet ADL5545 (Analog Devices) - 5
| Fabricante | Analog Devices |
| Descripción | 30 MHz to 6 GHz RF/IF Gain Block |
| Páginas / Página | 18 / 5 — Data Sheet. ADL5545. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| Revisión | B |
| Formato / tamaño de archivo | PDF / 373 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADL5545. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Thermal Resistance
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Data Sheet ADL5545 ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Table 3 lists the junction-to-air thermal resistance (θJA) and the Supply Voltage, VPOS 6.5 V junction-to-case thermal resistance (θJC) for the ADL5545. Input Power (50 Ω Impedance) 18 dBm Internal Power Dissipation 400 mW
Table 3. Thermal Resistance
(Pad Soldered to Ground)
Package Type θ 1 2 JA θJC Unit
Maximum Junction Temperature 150°C 3-Lead SOT-89 (RK-3) 53 15 °C/W Operating Temperature Range −40°C to +105°C 1 Measured on the ADL5545 evaluation board. For more information about Storage Temperature Range −65°C to +150°C board layout, see the Soldering Information and Recommended PCB Land Pattern section. 2 Stresses at or above those listed under Absolute Maximum Based on simulation with a standard JEDEC board per JESD51. Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 5 of 18 Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS 500 MHz TO 4 GHz FREQUENCY BAND 100 MHz TO 500 MHz FREQUENCY BAND 4 GHz TO 6 GHz FREQUENCY BAND GENERAL APPLICATIONS INFORMATION BASIC CONNECTIONS SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN OPERATION DOWN TO 30 MHz W-CDMA ACPR PERFORMANCE EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE NOTES NOTES
Data Sheet ADL5545 ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Table 3 lists the junction-to-air thermal resistance (θJA) and the Supply Voltage, VPOS 6.5 V junction-to-case thermal resistance (θJC) for the ADL5545. Input Power (50 Ω Impedance) 18 dBm Internal Power Dissipation 400 mW
Table 3. Thermal Resistance
(Pad Soldered to Ground)
Package Type θ 1 2 JA θJC Unit
Maximum Junction Temperature 150°C 3-Lead SOT-89 (RK-3) 53 15 °C/W Operating Temperature Range −40°C to +105°C 1 Measured on the ADL5545 evaluation board. For more information about Storage Temperature Range −65°C to +150°C board layout, see the Soldering Information and Recommended PCB Land Pattern section. 2 Stresses at or above those listed under Absolute Maximum Based on simulation with a standard JEDEC board per JESD51. Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 5 of 18 Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS 500 MHz TO 4 GHz FREQUENCY BAND 100 MHz TO 500 MHz FREQUENCY BAND 4 GHz TO 6 GHz FREQUENCY BAND GENERAL APPLICATIONS INFORMATION BASIC CONNECTIONS SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN OPERATION DOWN TO 30 MHz W-CDMA ACPR PERFORMANCE EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE NOTES NOTES