Datasheet HMC465 (Analog Devices) - 4
| Fabricante | Analog Devices |
| Descripción | GaAs pHEMT MMIC MODULATOR DRIVER AMPLIFIER, DC - 20 GHz |
| Páginas / Página | 8 / 4 — HMC465. GaAs pHEMT MMIC MODULATOR. DRIVER AMPLIFIER, DC - 20 GHz. … |
| Formato / tamaño de archivo | PDF / 472 Kb |
| Idioma del documento | Inglés |
HMC465. GaAs pHEMT MMIC MODULATOR. DRIVER AMPLIFIER, DC - 20 GHz. Absolute Maximum Ratings. Typical Supply Current vs. Vdd
Línea de modelo para esta hoja de datos
Versión de texto del documento
HMC465
v09.0114
GaAs pHEMT MMIC MODULATOR DRIVER AMPLIFIER, DC - 20 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +9V Vdd (V) Idd (mA) Gate Bias Voltage (Vgg1) -2 to 0V +7.5 161 +8.0 160 IP Gate Bias Current (Igg1) +3.2mA +8.5 159 H Gate Bias Voltage (Vgg2) (Vdd -8) V to +3 Vdc Gate Bias Current (Igg2) +3.2mA RF Input Power (RFIN)(Vdd = +8V) +23 dBm S - C Channel Temperature 175 °C K Continuous Pdiss (T = 85 °C) ELECTROSTATIC SENSITIVE DEVICE 2.17 W C (derate 24 mW/°C above 85 °C) OBSERVE HANDLING PRECAUTIONS Thermal Resistance 41.5 °C/W LO (channel to die bottom) Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C IN B A
Outline Drawing
S & G R E IV R - D S R IE LIF P M A
Die Packaging Information
[1] NOTES: Standard Alternate 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] 2. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS GP-1 (Gel Pack) [2] 3. DIE THICKNESS IS 0.004 (0.100) 4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE [1] Refer to the “Packaging Information” section for die 5. BACKSIDE METALLIZATION: GOLD packaging dimensions. 6. BACKSIDE METAL IS GROUND [2] For alternate packaging information contact Hittite 7. BOND PAD METALIZATION: GOLD Microwave Corporation. Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
4
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D
v09.0114
GaAs pHEMT MMIC MODULATOR DRIVER AMPLIFIER, DC - 20 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +9V Vdd (V) Idd (mA) Gate Bias Voltage (Vgg1) -2 to 0V +7.5 161 +8.0 160 IP Gate Bias Current (Igg1) +3.2mA +8.5 159 H Gate Bias Voltage (Vgg2) (Vdd -8) V to +3 Vdc Gate Bias Current (Igg2) +3.2mA RF Input Power (RFIN)(Vdd = +8V) +23 dBm S - C Channel Temperature 175 °C K Continuous Pdiss (T = 85 °C) ELECTROSTATIC SENSITIVE DEVICE 2.17 W C (derate 24 mW/°C above 85 °C) OBSERVE HANDLING PRECAUTIONS Thermal Resistance 41.5 °C/W LO (channel to die bottom) Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C IN B A
Outline Drawing
S & G R E IV R - D S R IE LIF P M A
Die Packaging Information
[1] NOTES: Standard Alternate 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] 2. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS GP-1 (Gel Pack) [2] 3. DIE THICKNESS IS 0.004 (0.100) 4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE [1] Refer to the “Packaging Information” section for die 5. BACKSIDE METALLIZATION: GOLD packaging dimensions. 6. BACKSIDE METAL IS GROUND [2] For alternate packaging information contact Hittite 7. BOND PAD METALIZATION: GOLD Microwave Corporation. Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
4
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D